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- Voltage - Supply：
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- Supplier Device Package：
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- Mounting Type：
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- Memory Type：
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- Technology：
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- Memory Format：
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- Clock Frequency：
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- Write Cycle Time - Word, Page：
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- Conditions sélectionnées:
Découvrez les produits 319
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Type | Technology | Memory Format | Clock Frequency | Memory Interface | Write Cycle Time - Word, Page | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Type | Technology | Memory Format | Clock Frequency | Memory Interface | Write Cycle Time - Word, Page | |
|
|
|
Winbond Electronics |
8,000
|
3 jours |
-
|
MOQ: 4000 MPQ: 1
|
IC FLASH 1G SPI 104MHZ 8WSON
|
Tape & Reel (TR) | SpiFlash | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (8x6) | Surface Mount | Non-Volatile | FLASH - NAND | Flash | 104MHz | SPI | - | ||
|
|
|
Winbond Electronics |
10,119
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 1G SPI 104MHZ 8WSON
|
Cut Tape (CT) | SpiFlash | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (8x6) | Surface Mount | Non-Volatile | FLASH - NAND | Flash | 104MHz | SPI | - | ||
|
|
|
Winbond Electronics |
10,119
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 1G SPI 104MHZ 8WSON
|
- | SpiFlash | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (8x6) | Surface Mount | Non-Volatile | FLASH - NAND | Flash | 104MHz | SPI | - | ||
|
|
|
Micron Technology Inc. |
1,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC FLASH 1G SPI 133MHZ 16SOP2
|
Tape & Reel (TR) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 16-SOIC (0.295"，7.50mm Width) | 16-SOP2 | Surface Mount | Non-Volatile | FLASH - NOR | Flash | 133MHz | SPI | 8ms，2.8ms | ||
|
|
|
Micron Technology Inc. |
1,073
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 1G SPI 133MHZ 16SOP2
|
Cut Tape (CT) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 16-SOIC (0.295"，7.50mm Width) | 16-SOP2 | Surface Mount | Non-Volatile | FLASH - NOR | Flash | 133MHz | SPI | 8ms，2.8ms | ||
|
|
|
Micron Technology Inc. |
1,073
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 1G SPI 133MHZ 16SOP2
|
- | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 16-SOIC (0.295"，7.50mm Width) | 16-SOP2 | Surface Mount | Non-Volatile | FLASH - NOR | Flash | 133MHz | SPI | 8ms，2.8ms | ||
|
|
|
Micron Technology Inc. |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC FLASH 1G SPI 133MHZ 24TPBGA
|
Tape & Reel (TR) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 24-TBGA | 24-T-PBGA (6x8) | Surface Mount | Non-Volatile | FLASH - NOR | Flash | 133MHz | SPI | 8ms，2.8ms | ||
|
|
|
Micron Technology Inc. |
2,636
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 1G SPI 133MHZ 24TPBGA
|
Cut Tape (CT) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 24-TBGA | 24-T-PBGA (6x8) | Surface Mount | Non-Volatile | FLASH - NOR | Flash | 133MHz | SPI | 8ms，2.8ms | ||
|
|
|
Micron Technology Inc. |
2,636
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 1G SPI 133MHZ 24TPBGA
|
- | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 24-TBGA | 24-T-PBGA (6x8) | Surface Mount | Non-Volatile | FLASH - NOR | Flash | 133MHz | SPI | 8ms，2.8ms | ||
|
|
|
Micron Technology Inc. |
1,172
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 1G SPI 133MHZ 16SOP2
|
Tray | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 16-SOIC (0.295"，7.50mm Width) | 16-SOP2 | Surface Mount | Non-Volatile | FLASH - NOR | Flash | 133MHz | SPI | 8ms，2.8ms | ||
|
|
|
GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
SPI NAND FLASH
|
Tape & Reel (TR) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | Non-Volatile | FLASH - NAND | Flash | 120MHz | SPI - Quad I/O | 700μs | ||
|
|
|
GigaDevice Semiconductor (HK) Limited |
309
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SPI NAND FLASH
|
Cut Tape (CT) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | Non-Volatile | FLASH - NAND | Flash | 120MHz | SPI - Quad I/O | 700μs | ||
|
|
|
GigaDevice Semiconductor (HK) Limited |
309
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SPI NAND FLASH
|
- | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | Non-Volatile | FLASH - NAND | Flash | 120MHz | SPI - Quad I/O | 700μs | ||
|
|
|
Micron Technology Inc. |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC FLASH 1G SPI 166MHZ TBGA
|
Tape & Reel (TR) | - | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | 24-LBGA | 24-T-PBGA (6x8) | Surface Mount | Non-Volatile | FLASH - NOR | Flash | 166MHz | SPI | 8ms，2.8ms | ||
|
|
|
Micron Technology Inc. |
2
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 1G SPI 166MHZ TBGA
|
Cut Tape (CT) | - | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | 24-LBGA | 24-T-PBGA (6x8) | Surface Mount | Non-Volatile | FLASH - NOR | Flash | 166MHz | SPI | 8ms，2.8ms | ||
|
|
|
Micron Technology Inc. |
2
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 1G SPI 166MHZ TBGA
|
- | - | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | 24-LBGA | 24-T-PBGA (6x8) | Surface Mount | Non-Volatile | FLASH - NOR | Flash | 166MHz | SPI | 8ms，2.8ms | ||
|
|
|
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC FLASH 1G SPI 104MHZ 8WSON
|
Tape & Reel (TR) | SpiFlash | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (8x6) | Surface Mount | Non-Volatile | FLASH - NAND | Flash | 104MHz | SPI | - | ||
|
|
|
GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
|
MOQ: 4800 MPQ: 1
|
SPI NAND FLASH
|
Tray | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | Non-Volatile | FLASH - NAND | Flash | 120MHz | SPI - Quad I/O | 700μs | ||
|
|
|
GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
|
MOQ: 4800 MPQ: 1
|
SPI NAND FLASH
|
Tray | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | Non-Volatile | FLASH - NAND | Flash | 120MHz | SPI - Quad I/O | 700μs | ||
|
|
|
GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
SPI NAND FLASH
|
Tape & Reel (TR) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | Non-Volatile | FLASH - NAND | Flash | 120MHz | SPI - Quad I/O | 700μs |
