- Packaging:
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- Voltage - Supply:
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- Operating Temperature:
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- Supplier Device Package:
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- Technology:
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- Access Time:
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- Conditions sélectionnées:
Découvrez les produits 97
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Technology | Access Time | Write Cycle Time - Word, Page | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Technology | Access Time | Write Cycle Time - Word, Page | ||
ISSI,Integrated Silicon Solution Inc |
1,262
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 90TFBGA
|
Tray | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 90-TFBGA | 90-TFBGA (8x13) | SDRAM | 5.4ns | - | ||||
Alliance Memory,Inc. |
88
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 90TFBGA
|
Tray | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 90-TFBGA | 90-TFBGA (8x13) | SDRAM | 5ns | 2ns | ||||
ISSI,Integrated Silicon Solution Inc |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 86TSOP II
|
Tray | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 86-TFSOP (0.400",10.16mm Width) | 86-TSOP II | SDRAM | 5.4ns | - | ||||
Alliance Memory,Inc. |
22
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 90FBGA
|
Tray | 1.14 V ~ 1.95 V | -40°C ~ 85°C (TA) | 90-VFBGA | 90-FBGA (8x13) | SDRAM - Mobile | 5.5ns | 15ns | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 256M PARALLEL 90VFBGA
|
Tape & Reel (TR) | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 90-TFBGA | 90-VFBGA (8x13) | SDRAM - Mobile LPDDR | 5ns | 15ns | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 256M PARALLEL 90VFBGA
|
Tape & Reel (TR) | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 90-TFBGA | 90-VFBGA (8x13) | SDRAM - Mobile LPSDR | 5.4ns | 15ns | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 256M PARALLEL 90VFBGA
|
Tape & Reel (TR) | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 90-TFBGA | 90-VFBGA (8x13) | SDRAM - Mobile LPSDR | 5.4ns | 15ns | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 240 MPQ: 1
|
IC DRAM 256M PARALLEL 90VFBGA
|
Tray | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 90-TFBGA | 90-VFBGA (8x13) | SDRAM - Mobile LPDDR | 5ns | 15ns | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 240 MPQ: 1
|
IC DRAM 256M PARALLEL 90VFBGA
|
Tray | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 90-TFBGA | 90-VFBGA (8x13) | SDRAM - Mobile LPSDR | 5.4ns | 15ns | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 240 MPQ: 1
|
IC DRAM 256M PARALLEL 90VFBGA
|
Tray | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 90-TFBGA | 90-VFBGA (8x13) | SDRAM - Mobile LPSDR | 5.4ns | 15ns | ||||
Alliance Memory,Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC DRAM 256M PARALLEL 90FBGA
|
Tape & Reel (TR) | 1.14 V ~ 1.95 V | -40°C ~ 85°C (TA) | 90-VFBGA | 90-FBGA (8x13) | SDRAM - Mobile | 5.5ns | 15ns | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 256M PARALLEL 90TFBGA
|
Tape & Reel (TR) | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 90-TFBGA | 90-TFBGA (8x13) | SDRAM | 5ns | - | ||||
Alliance Memory,Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC DRAM 256M PARALLEL 86TSOP II
|
Tape & Reel (TR) | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 86-TFSOP (0.400",10.16mm Width) | 86-TSOP II | SDRAM | 5.5ns | - | ||||
ISSI,Integrated Silicon Solution Inc |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 256M PARALLEL 90TFBGA
|
Tape & Reel (TR) | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | 90-TFBGA | 90-TFBGA (8x13) | SDRAM - Mobile LPDDR | 5.5ns | 15ns | ||||
ISSI,Integrated Silicon Solution Inc |
Enquête
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC DRAM 256M PARALLEL 86TSOP II
|
Tape & Reel (TR) | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 86-TFSOP (0.400",10.16mm Width) | 86-TSOP II | SDRAM | 5.4ns | - | ||||
ISSI,Integrated Silicon Solution Inc |
Enquête
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC DRAM 256M PARALLEL 144LFBGA
|
Tape & Reel (TR) | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | 144-LFBGA | 144-LFBGA (12x12) | SDRAM - DDR | 700ps | 15ns | ||||
Alliance Memory,Inc. |
Enquête
|
- |
-
|
MOQ: 108 MPQ: 1
|
IC DRAM 256M PARALLEL 86TSOP II
|
Tray | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 86-TFSOP (0.400",10.16mm Width) | 86-TSOP II | SDRAM | 5.5ns | - | ||||
ISSI,Integrated Silicon Solution Inc |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 256M PARALLEL 90TFBGA
|
Tape & Reel (TR) | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 90-TFBGA | 90-TFBGA (8x13) | SDRAM | 5.4ns | - | ||||
Alliance Memory,Inc. |
Enquête
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC DRAM 256M PARALLEL 90TFBGA
|
Tape & Reel (TR) | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 90-TFBGA | 90-TFBGA (8x13) | SDRAM | 5ns | 2ns | ||||
ISSI,Integrated Silicon Solution Inc |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 256M PARALLEL 90TFBGA
|
Tape & Reel (TR) | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 90-TFBGA | 90-TFBGA (8x13) | SDRAM - Mobile | 5.5ns | - |