- Packaging:
-
- Series:
-
- Voltage - Supply:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
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- Mounting Type:
-
- Conditions sélectionnées:
Découvrez les produits 42
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Write Cycle Time - Word, Page | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Write Cycle Time - Word, Page | ||
ROHM Semiconductor |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
105°C OPERATION SPI BUS EEPR
|
Tape & Reel (TR) | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOP-J | Surface Mount | 5ms | ||||
ROHM Semiconductor |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
105°C OPERATION SPI BUS EEPR
|
Cut Tape (CT) | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOP-J | Surface Mount | 5ms | ||||
ROHM Semiconductor |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
105°C OPERATION SPI BUS EEPR
|
- | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOP-J | Surface Mount | 5ms | ||||
ROHM Semiconductor |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
105°C OPERATION SPI BUS EEPR
|
Tape & Reel (TR) | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | 8-SOIC (0.173",4.40mm Width) | 8-SOP | Surface Mount | 5ms | ||||
ROHM Semiconductor |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
105°C OPERATION SPI BUS EEPR
|
Cut Tape (CT) | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | 8-SOIC (0.173",4.40mm Width) | 8-SOP | Surface Mount | 5ms | ||||
ROHM Semiconductor |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
105°C OPERATION SPI BUS EEPR
|
- | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | 8-SOIC (0.173",4.40mm Width) | 8-SOP | Surface Mount | 5ms | ||||
ROHM Semiconductor |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
105°C OPERATION SPI BUS EEPR
|
Tape & Reel (TR) | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | 8-TSSOP (0.173",4.40mm Width) | 8-TSSOP-B | Surface Mount | 5ms | ||||
ROHM Semiconductor |
2,974
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
105°C OPERATION SPI BUS EEPR
|
Cut Tape (CT) | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | 8-TSSOP (0.173",4.40mm Width) | 8-TSSOP-B | Surface Mount | 5ms | ||||
ROHM Semiconductor |
2,974
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
105°C OPERATION SPI BUS EEPR
|
- | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | 8-TSSOP (0.173",4.40mm Width) | 8-TSSOP-B | Surface Mount | 5ms | ||||
ABLIC U.S.A. Inc. |
Enquête
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC EEPROM 512K SPI 10MHZ 8SOP
|
Tape & Reel (TR) | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOP | Surface Mount | 5ms | ||||
ABLIC U.S.A. Inc. |
13
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC EEPROM 512K SPI 10MHZ 8SOP
|
Cut Tape (CT) | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOP | Surface Mount | 5ms | ||||
ABLIC U.S.A. Inc. |
13
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC EEPROM 512K SPI 10MHZ 8SOP
|
- | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOP | Surface Mount | 5ms | ||||
ABLIC U.S.A. Inc. |
Enquête
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC EEPROM 512K SPI 10MHZ 8TSSOP
|
Tape & Reel (TR) | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | 8-TSSOP (0.173",4.40mm Width) | 8-TSSOP | Surface Mount | 5ms | ||||
ABLIC U.S.A. Inc. |
30
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC EEPROM 512K SPI 10MHZ 8TSSOP
|
Cut Tape (CT) | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | 8-TSSOP (0.173",4.40mm Width) | 8-TSSOP | Surface Mount | 5ms | ||||
ABLIC U.S.A. Inc. |
30
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC EEPROM 512K SPI 10MHZ 8TSSOP
|
- | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | 8-TSSOP (0.173",4.40mm Width) | 8-TSSOP | Surface Mount | 5ms | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 145 MPQ: 1
|
IC EEPROM 512K SPI 10MHZ 8DIP
|
Tube | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | 8-DIP (0.300",7.62mm) | 8-PDIP | Through Hole | 10ms | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 150 MPQ: 1
|
IC EEPROM 512K SPI 10MHZ 8DIP
|
Tube | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | 8-DIP (0.300",7.62mm) | 8-PDIP | Through Hole | 10ms | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC EEPROM 512K SPI 10MHZ 8LAP
|
Tube | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | 8-TDFN | 8-LAP (8x5) | Surface Mount | 10ms | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC EEPROM 512K SPI 10MHZ 8LAP
|
Tube | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | 8-TDFN | 8-LAP (8x5) | Surface Mount | 10ms | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 150 MPQ: 1
|
IC EEPROM 512K SPI 10MHZ 8DIP
|
Tube | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | 8-DIP (0.300",7.62mm) | 8-PDIP | Through Hole | 10ms |