- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Memory Size：
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- Technology：
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- Clock Frequency：
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- Write Cycle Time - Word, Page：
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- Conditions sélectionnées:
Découvrez les produits 380
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Size | Technology | Clock Frequency | Access Time | Write Cycle Time - Word, Page | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Size | Technology | Clock Frequency | Access Time | Write Cycle Time - Word, Page | |
|
|
|
Winbond Electronics |
215
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 134VFBGA
|
Tray | -40°C ~ 85°C (TA) | 134-VFBGA | 134-VFBGA (10x11.5) | Surface Mount | 1Gb (32M x 32) | SDRAM - Mobile LPDDR2 | 400MHz | - | 15ns | ||
|
|
|
Alliance Memory，Inc. |
187
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 4G PARALLEL 134FBGA
|
Tray | -40°C ~ 85°C (TC) | 134-VFBGA | 134-FBGA (10x11.5) | Surface Mount | 4Gb (128M x 32) | SDRAM - Mobile LPDDR2 | 533MHz | - | 15ns | ||
|
|
|
Alliance Memory，Inc. |
171
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
134-BALL FBGA (10X11.5X1.0)
|
Tray | -20°C ~ 85°C (TA) | 134-TFBGA | 134-FBGA (10x11.5) | Surface Mount | 256Mb (8M x 32) | SDRAM - Mobile LPDDR2 | 400MHz | - | 15ns | ||
|
|
|
Winbond Electronics |
4,611
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 134VFBGA
|
Tray | -25°C ~ 85°C (TC) | 134-VFBGA | 134-VFBGA (10x11.5) | Surface Mount | 256Mb (16M x 16) | SDRAM - Mobile LPDDR2 | 400MHz | - | 15ns | ||
|
|
|
Winbond Electronics |
171
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 134VFBGA
|
Tray | -40°C ~ 85°C (TA) | 134-VFBGA | 134-VFBGA (10x11.5) | Surface Mount | 256Mb (16M x 16) | SDRAM - Mobile LPDDR2 | 400MHz | - | 15ns | ||
|
|
|
Winbond Electronics |
171
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 134VFBGA
|
Tray | -40°C ~ 85°C (TA) | 134-VFBGA | 134-VFBGA (10x11.5) | Surface Mount | 512Mb (32M x 16) | SDRAM - Mobile LPDDR2 | 400MHz | - | 15ns | ||
|
|
|
Winbond Electronics |
156
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 134VFBGA
|
Tray | -40°C ~ 85°C (TA) | 134-VFBGA | 134-VFBGA (10x11.5) | Surface Mount | 512Mb (16M x 32) | SDRAM - Mobile LPDDR2 | 400MHz | - | 15ns | ||
|
|
|
Alliance Memory，Inc. |
128
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
134-BALL FBGA (10X11.5X1.0)
|
Tray | -40°C ~ 85°C (TA) | 134-VFBGA | 134-FBGA (10x11.5) | Surface Mount | 1Gb (64M x 16) | SDRAM - Mobile LPDDR2 | 400MHz | - | 15ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,000
|
3 jours |
-
|
MOQ: 2000 MPQ: 1
|
IC DRAM 1G PARALLEL 134TFBGA
|
Tape & Reel (TR) | -40°C ~ 85°C (TC) | 134-TFBGA | 134-TFBGA (10x11.5) | Surface Mount | 1Gb (64M x 16) | SDRAM - Mobile LPDDR2-S4 | 400MHz | - | 15ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,335
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 134TFBGA
|
Cut Tape (CT) | -40°C ~ 85°C (TC) | 134-TFBGA | 134-TFBGA (10x11.5) | Surface Mount | 1Gb (64M x 16) | SDRAM - Mobile LPDDR2-S4 | 400MHz | - | 15ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,335
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 134TFBGA
|
- | -40°C ~ 85°C (TC) | 134-TFBGA | 134-TFBGA (10x11.5) | Surface Mount | 1Gb (64M x 16) | SDRAM - Mobile LPDDR2-S4 | 400MHz | - | 15ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,000
|
3 jours |
-
|
MOQ: 2000 MPQ: 1
|
IC DRAM 1G PARALLEL 134TFBGA
|
Tape & Reel (TR) | -40°C ~ 85°C (TC) | 134-TFBGA | 134-TFBGA (10x11.5) | Surface Mount | 1Gb (32M x 32) | SDRAM - Mobile LPDDR2-S4 | 400MHz | - | 15ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,335
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 134TFBGA
|
Cut Tape (CT) | -40°C ~ 85°C (TC) | 134-TFBGA | 134-TFBGA (10x11.5) | Surface Mount | 1Gb (32M x 32) | SDRAM - Mobile LPDDR2-S4 | 400MHz | - | 15ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,335
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 134TFBGA
|
- | -40°C ~ 85°C (TC) | 134-TFBGA | 134-TFBGA (10x11.5) | Surface Mount | 1Gb (32M x 32) | SDRAM - Mobile LPDDR2-S4 | 400MHz | - | 15ns | ||
|
|
|
Alliance Memory，Inc. |
138
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 4G PARALLEL 134FBGA
|
Tray | -40°C ~ 85°C (TC) | 134-VFBGA | 134-FBGA (10x11.5) | Surface Mount | 4Gb (128M x 32) | SDRAM - Mobile LPDDR2 | 400MHz | - | 15ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
254
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 134TFBGA
|
Tray | -40°C ~ 85°C (TC) | 134-TFBGA | 134-TFBGA (10x11.5) | Surface Mount | 1Gb (32M x 32) | SDRAM - Mobile LPDDR2-S4 | 400MHz | - | 15ns | ||
|
|
|
Micron Technology Inc. |
1,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 4G PARALLEL 216WFBGA
|
Tray | -40°C ~ 85°C (TC) | 216-WFBGA | 216-WFBGA (12x12) | Surface Mount | 4Gb (64M x 64) | SDRAM - Mobile LPDDR2 | 533MHz | - | - | ||
|
|
|
Winbond Electronics |
97
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 134VFBGA
|
Tray | -40°C ~ 85°C (TA) | 134-VFBGA | 134-VFBGA (10x11.5) | Surface Mount | 1Gb (64M x 16) | SDRAM - Mobile LPDDR2 | 400MHz | - | 15ns | ||
|
|
|
Alliance Memory，Inc. |
22
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 90FBGA
|
Tray | -40°C ~ 85°C (TA) | 90-VFBGA | 90-FBGA (8x13) | Surface Mount | 256Mb (8M x 32) | SDRAM - Mobile | 166MHz | 5.5ns | 15ns | ||
|
|
|
Micron Technology Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 134VFBGA
|
Tray | -40°C ~ 105°C (TC) | 134-VFBGA | 134-VFBGA (10x11.5) | Surface Mount | 1Gb (64M x 16) | SDRAM - Mobile LPDDR2 | 533MHz | - | - |
