- Packaging:
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- Series:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Mounting Type:
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- Technology:
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- Clock Frequency:
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- Memory Interface:
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- Write Cycle Time - Word, Page:
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- Conditions sélectionnées:
Découvrez les produits 28
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Mounting Type | Memory Size | Technology | Clock Frequency | Memory Interface | Write Cycle Time - Word, Page | ||
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Mounting Type | Memory Size | Technology | Clock Frequency | Memory Interface | Write Cycle Time - Word, Page | ||
GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
|
MOQ: 12000 MPQ: 1
|
NOR FLASH
|
Tape & Reel (TR) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 8Mb (1M x 8) | FLASH - NOR | 120MHz | SPI - Quad I/O | 50μs,2.4ms | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC FLASH 16M SPI 133MHZ 8USON
|
Tape & Reel (TR) | SpiFlash | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 133MHz | SPI - Quad I/O | 3ms | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC FLASH 16M SPI 104MHZ 8USON
|
Tape & Reel (TR) | SpiFlash | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 104MHz | SPI | 3ms | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC FLASH 16M SPI 104MHZ 8USON
|
Tape & Reel (TR) | SpiFlash | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 104MHz | SPI | 3ms | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 16M SPI 104MHZ 8USON
|
Cut Tape (CT) | SpiFlash | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 104MHz | SPI | 3ms | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 16M SPI 104MHZ 8USON
|
- | SpiFlash | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 104MHz | SPI | 3ms | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC FLASH 16M SPI 104MHZ 8USON
|
Tape & Reel (TR) | SpiFlash | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 104MHz | SPI - Quad I/O | 50μs,3ms | ||||
GigaDevice Semiconductor (HK) Limited |
4,000
|
3 jours |
-
|
MOQ: 3000 MPQ: 1
|
NOR FLASH
|
Tape & Reel (TR) | - | 1.65 V ~ 2 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 32Mb (4M x 8) | FLASH - NOR | 120MHz | SPI - Quad I/O | 2.4ms | ||||
GigaDevice Semiconductor (HK) Limited |
6,490
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
NOR FLASH
|
Cut Tape (CT) | - | 1.65 V ~ 2 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 32Mb (4M x 8) | FLASH - NOR | 120MHz | SPI - Quad I/O | 2.4ms | ||||
GigaDevice Semiconductor (HK) Limited |
6,490
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
NOR FLASH
|
- | - | 1.65 V ~ 2 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 32Mb (4M x 8) | FLASH - NOR | 120MHz | SPI - Quad I/O | 2.4ms | ||||
GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
NOR FLASH
|
Tape & Reel (TR) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 120MHz | SPI - Quad I/O | 50μs,2.4ms | ||||
GigaDevice Semiconductor (HK) Limited |
1,885
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
NOR FLASH
|
Cut Tape (CT) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 120MHz | SPI - Quad I/O | 50μs,2.4ms | ||||
GigaDevice Semiconductor (HK) Limited |
1,885
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
NOR FLASH
|
- | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 120MHz | SPI - Quad I/O | 50μs,2.4ms | ||||
GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
NOR FLASH
|
Tape & Reel (TR) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 32Mb (4M x 8) | FLASH - NOR | 120MHz | SPI - Quad I/O | 50μs,2.4ms | ||||
GigaDevice Semiconductor (HK) Limited |
1,712
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
NOR FLASH
|
Cut Tape (CT) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 32Mb (4M x 8) | FLASH - NOR | 120MHz | SPI - Quad I/O | 50μs,2.4ms | ||||
GigaDevice Semiconductor (HK) Limited |
1,712
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
NOR FLASH
|
- | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 32Mb (4M x 8) | FLASH - NOR | 120MHz | SPI - Quad I/O | 50μs,2.4ms | ||||
GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
NOR FLASH
|
Tape & Reel (TR) | - | 1.65 V ~ 2.1 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 104MHz | SPI - Quad I/O | 50μs,2.4ms | ||||
GigaDevice Semiconductor (HK) Limited |
1,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
NOR FLASH
|
Cut Tape (CT) | - | 1.65 V ~ 2.1 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 104MHz | SPI - Quad I/O | 50μs,2.4ms | ||||
GigaDevice Semiconductor (HK) Limited |
1,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
NOR FLASH
|
- | - | 1.65 V ~ 2.1 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 104MHz | SPI - Quad I/O | 50μs,2.4ms | ||||
Macronix |
Enquête
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC FLASH SERIAL NOR 32MBIT 8USON
|
Tape & Reel (TR) | MXSMIO | 2.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | Surface Mount | 32Mb (8M x 4) | FLASH - NOR | 133MHz | SPI - Quad I/O | 50μs,1.2ms |