- Voltage - Supply:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Mounting Type:
-
- Memory Size:
-
- Clock Frequency:
-
- Memory Interface:
-
- Write Cycle Time - Word, Page:
-
- Conditions sélectionnées:
Découvrez les produits 718
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Size | Technology | Clock Frequency | Memory Interface | Write Cycle Time - Word, Page | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Size | Technology | Clock Frequency | Memory Interface | Write Cycle Time - Word, Page | ||
Winbond Electronics |
68,000
|
3 jours |
-
|
MOQ: 4000 MPQ: 1
|
IC FLASH 2M SPI 104MHZ 8USON
|
Tape & Reel (TR) | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 2Mb (256K x 8) | Flash | 104MHz | SPI | 800μs | ||||
Winbond Electronics |
75,043
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 2M SPI 104MHZ 8USON
|
Cut Tape (CT) | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 2Mb (256K x 8) | Flash | 104MHz | SPI | 800μs | ||||
Winbond Electronics |
75,043
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 2M SPI 104MHZ 8USON
|
- | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 2Mb (256K x 8) | Flash | 104MHz | SPI | 800μs | ||||
Winbond Electronics |
48,000
|
3 jours |
-
|
MOQ: 4000 MPQ: 1
|
IC FLASH 4M SPI 104MHZ 8USON
|
Tape & Reel (TR) | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 4Mb (512K x 8) | Flash | 104MHz | SPI | 800μs | ||||
Winbond Electronics |
50,619
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 104MHZ 8USON
|
Cut Tape (CT) | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 4Mb (512K x 8) | Flash | 104MHz | SPI | 800μs | ||||
Winbond Electronics |
50,619
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 104MHZ 8USON
|
- | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 4Mb (512K x 8) | Flash | 104MHz | SPI | 800μs | ||||
Winbond Electronics |
142,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC FLASH 8M SPI 104MHZ 8SOIC
|
Tape & Reel (TR) | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | 8Mb (1M x 8) | FLASH - NOR | 104MHz | SPI | 3ms | ||||
Winbond Electronics |
142,947
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 8M SPI 104MHZ 8SOIC
|
Cut Tape (CT) | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | 8Mb (1M x 8) | FLASH - NOR | 104MHz | SPI | 3ms | ||||
Winbond Electronics |
142,947
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 8M SPI 104MHZ 8SOIC
|
- | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | 8Mb (1M x 8) | FLASH - NOR | 104MHz | SPI | 3ms | ||||
Winbond Electronics |
18,751
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 2M SPI 104MHZ 8SOIC
|
Tube | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | 2Mb (256K x 8) | Flash | 104MHz | SPI | 800μs | ||||
Winbond Electronics |
96,505
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 104MHZ 8SOIC
|
Tube | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | 4Mb (512K x 8) | Flash | 104MHz | SPI | 800μs | ||||
Winbond Electronics |
41,317
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 8M SPI 104MHZ 8SOIC
|
Tube | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.209",5.30mm Width) | 8-SOIC | Surface Mount | 8Mb (1M x 8) | FLASH - NOR | 104MHz | SPI | 3ms | ||||
Winbond Electronics |
24,868
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 8M SPI 104MHZ 8SOIC
|
Tube | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | 8Mb (1M x 8) | FLASH - NOR | 104MHz | SPI | 3ms | ||||
Winbond Electronics |
16,000
|
3 jours |
-
|
MOQ: 4000 MPQ: 1
|
IC FLASH 8M SPI 104MHZ 8USON
|
Tape & Reel (TR) | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 8Mb (1M x 8) | FLASH - NOR | 104MHz | SPI | 3ms | ||||
Winbond Electronics |
21,711
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 8M SPI 104MHZ 8USON
|
Cut Tape (CT) | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 8Mb (1M x 8) | FLASH - NOR | 104MHz | SPI | 3ms | ||||
Winbond Electronics |
21,711
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 8M SPI 104MHZ 8USON
|
- | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 8Mb (1M x 8) | FLASH - NOR | 104MHz | SPI | 3ms | ||||
Winbond Electronics |
141,573
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 16M SPI 133MHZ 8SOIC
|
Tube | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.209",5.30mm Width) | 8-SOIC | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 133MHz | SPI - Quad I/O | 3ms | ||||
Winbond Electronics |
67,125
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 16M SPI 133MHZ 8SOIC
|
Tube | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | 16Mb (2M x 8) | FLASH - NOR | 133MHz | SPI - Quad I/O | 3ms | ||||
Winbond Electronics |
152,000
|
3 jours |
-
|
MOQ: 2000 MPQ: 1
|
IC FLASH 32M SPI 133MHZ 8SOIC
|
Tape & Reel (TR) | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.209",5.30mm Width) | 8-SOIC | Surface Mount | 32Mb (4M x 8) | FLASH - NOR | 133MHz | SPI - Quad I/O | 3ms | ||||
Winbond Electronics |
152,130
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 32M SPI 133MHZ 8SOIC
|
Cut Tape (CT) | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.209",5.30mm Width) | 8-SOIC | Surface Mount | 32Mb (4M x 8) | FLASH - NOR | 133MHz | SPI - Quad I/O | 3ms |