- Series:
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- Operating Temperature:
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- Supplier Device Package:
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- Clock Frequency:
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- Access Time:
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- Write Cycle Time - Word, Page:
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- Conditions sélectionnées:
Découvrez les produits 241
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Memory Size | Clock Frequency | Access Time | Write Cycle Time - Word, Page | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Memory Size | Clock Frequency | Access Time | Write Cycle Time - Word, Page | ||
Micron Technology Inc. |
8,000
|
3 jours |
-
|
MOQ: 2000 MPQ: 1
|
IC DRAM 2G PARALLEL 96FBGA
|
Tape & Reel (TR) | - | 0°C ~ 95°C (TC) | 96-FBGA (8x14) | 2Gb (128M x 16) | 800MHz | 13.75ns | - | ||||
Micron Technology Inc. |
9,566
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 2G PARALLEL 96FBGA
|
Cut Tape (CT) | - | 0°C ~ 95°C (TC) | 96-FBGA (8x14) | 2Gb (128M x 16) | 800MHz | 13.75ns | - | ||||
Micron Technology Inc. |
9,566
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 2G PARALLEL 96FBGA
|
- | - | 0°C ~ 95°C (TC) | 96-FBGA (8x14) | 2Gb (128M x 16) | 800MHz | 13.75ns | - | ||||
ISSI,Integrated Silicon Solution Inc |
6,157
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 2G PARALLEL 96TWBGA
|
Tray | - | -40°C ~ 95°C (TC) | 96-TWBGA (9x13) | 2Gb (128M x 16) | 667MHz | 20ns | 15ns | ||||
Alliance Memory,Inc. |
1,123
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 4G PARALLEL 96FBGA
|
Tray | - | 0°C ~ 95°C (TC) | 96-FBGA (13.5x9) | 4Gb (256M x 16) | 800MHz | 20ns | 15ns | ||||
Alliance Memory,Inc. |
671
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 4G PARALLEL 96FBGA
|
Tray | - | -40°C ~ 95°C (TC) | 96-FBGA (13.5x9) | 4Gb (256M x 16) | 800MHz | 20ns | 15ns | ||||
ISSI,Integrated Silicon Solution Inc |
839
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 96TWBGA
|
Tray | - | 0°C ~ 95°C (TC) | 96-TWBGA (9x13) | 1Gb (64M x 16) | 800MHz | 20ns | 15ns | ||||
ISSI,Integrated Silicon Solution Inc |
118
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 96TWBGA
|
Tray | - | -40°C ~ 95°C (TC) | 96-TWBGA (9x13) | 1Gb (64M x 16) | 800MHz | 20ns | 15ns | ||||
ISSI,Integrated Silicon Solution Inc |
650
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 2G PARALLEL 96TWBGA
|
Tray | - | -40°C ~ 95°C (TC) | 96-TWBGA (9x13) | 2Gb (128M x 16) | 800MHz | 20ns | 15ns | ||||
ISSI,Integrated Silicon Solution Inc |
367
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 2G PARALLEL 96TWBGA
|
Tray | - | 0°C ~ 95°C (TC) | 96-TWBGA (9x13) | 2Gb (128M x 16) | 800MHz | 20ns | 15ns | ||||
ISSI,Integrated Silicon Solution Inc |
127
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 8G PARALLEL 96FBGA
|
- | - | 0°C ~ 95°C (TC) | 96-TWBGA (10x14) | 8Gb (512M x 16) | 800MHz | 20ns | - | ||||
ISSI,Integrated Silicon Solution Inc |
134
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 8G PARALLEL 96FBGA
|
- | - | -40°C ~ 95°C (TC) | 96-TWBGA (10x14) | 8Gb (512M x 16) | 800MHz | 20ns | - | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 1G PARALLEL 96WBGA
|
Tape & Reel (TR) | - | 0°C ~ 85°C (TC) | 96-WBGA (9x13) | 1Gb (64M x 16) | 667MHz | 20ns | - | ||||
Winbond Electronics |
1,961
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 96WBGA
|
Cut Tape (CT) | - | 0°C ~ 85°C (TC) | 96-WBGA (9x13) | 1Gb (64M x 16) | 667MHz | 20ns | - | ||||
Winbond Electronics |
1,961
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 96WBGA
|
- | - | 0°C ~ 85°C (TC) | 96-WBGA (9x13) | 1Gb (64M x 16) | 667MHz | 20ns | - | ||||
Winbond Electronics |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 1G PARALLEL 96WBGA
|
Tape & Reel (TR) | - | 0°C ~ 85°C (TC) | 96-WBGA (9x13) | 1Gb (64M x 16) | 800MHz | 20ns | - | ||||
Winbond Electronics |
1,202
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 96WBGA
|
Cut Tape (CT) | - | 0°C ~ 85°C (TC) | 96-WBGA (9x13) | 1Gb (64M x 16) | 800MHz | 20ns | - | ||||
Winbond Electronics |
1,202
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 96WBGA
|
- | - | 0°C ~ 85°C (TC) | 96-WBGA (9x13) | 1Gb (64M x 16) | 800MHz | 20ns | - | ||||
Winbond Electronics |
555
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 96WBGA
|
Tray | - | 0°C ~ 85°C (TC) | 96-WBGA (9x13) | 1Gb (64M x 16) | 800MHz | 20ns | - | ||||
Winbond Electronics |
280
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 96WBGA
|
Tray | - | 0°C ~ 85°C (TC) | 96-WBGA (9x13) | 1Gb (64M x 16) | 667MHz | 20ns | - |