- Packaging：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Memory Size：
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- Conditions sélectionnées:
Découvrez les produits 44
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Size | Write Cycle Time - Word, Page | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Size | Write Cycle Time - Word, Page | |
|
Microchip Technology |
3,000
|
3 jours |
-
|
MOQ: 3000 MPQ: 1
|
IC FLASH 2M SPI 40MHZ 8USON
|
Tape & Reel (TR) | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 2Mb (256K x 8) | 3.5ms | |||
|
|
Microchip Technology |
3,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 2M SPI 40MHZ 8USON
|
Cut Tape (CT) | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 2Mb (256K x 8) | 3.5ms | |||
|
|
Microchip Technology |
3,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 2M SPI 40MHZ 8USON
|
- | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 2Mb (256K x 8) | 3.5ms | |||
|
|
Microchip Technology |
1,862
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8SOIC
|
Tube | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | 4Mb (512K x 8) | 5ms | |||
|
|
Microchip Technology |
3,000
|
3 jours |
-
|
MOQ: 3000 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8UDFN
|
Tape & Reel (TR) | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-UDFN (2x3) | Surface Mount | 4Mb (512K x 8) | 5ms | |||
|
|
Microchip Technology |
3,676
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8UDFN
|
Cut Tape (CT) | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-UDFN (2x3) | Surface Mount | 4Mb (512K x 8) | 5ms | |||
|
|
Microchip Technology |
3,676
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8UDFN
|
- | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-UDFN (2x3) | Surface Mount | 4Mb (512K x 8) | 5ms | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8SOIC
|
Tape & Reel (TR) | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | 4Mb (512K x 8) | 5ms | |||
|
|
Microchip Technology |
1,439
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8SOIC
|
Cut Tape (CT) | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | 4Mb (512K x 8) | 5ms | |||
|
|
Microchip Technology |
1,439
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8SOIC
|
- | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | 4Mb (512K x 8) | 5ms | |||
|
|
Microchip Technology |
684
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8SOIC
|
Tube | 2.3 V ~ 3.6 V | -40°C ~ 105°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | 4Mb (512K x 8) | 5ms | |||
|
|
Microchip Technology |
995
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 8M SPI 40MHZ 8SOIC
|
Tube | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | 8Mb (1M x 8) | 1ms | |||
|
|
Microchip Technology |
710
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 2M SPI 40MHZ 8SOIC
|
Tube | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | 2Mb (256K x 8) | 3.5ms | |||
|
|
Microchip Technology |
486
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8SOIC
|
Tube | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | 4Mb (512K x 8) | 1ms | |||
|
|
Microchip Technology |
100
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8WDFN
|
Tube | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WDFN (5x6) | Surface Mount | 4Mb (512K x 8) | 5ms | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8USON
|
Tape & Reel (TR) | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 4Mb (512K x 8) | 1ms | |||
|
|
Microchip Technology |
115
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8USON
|
Cut Tape (CT) | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 4Mb (512K x 8) | 1ms | |||
|
|
Microchip Technology |
115
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8USON
|
- | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-UFDFN Exposed Pad | 8-USON (2x3) | Surface Mount | 4Mb (512K x 8) | 1ms | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC FLASH 2M SPI 40MHZ 8SOIC
|
Tape & Reel (TR) | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | 2Mb (256K x 8) | 3.5ms | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC FLASH 4M SPI 40MHZ 8SOIC
|
Tape & Reel (TR) | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | 4Mb (512K x 8) | 1ms |
