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- Conditions sélectionnées:
Découvrez les produits 4,316
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Size | Technology | Memory Format | Clock Frequency | Access Time | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Size | Technology | Memory Format | Clock Frequency | Access Time | |
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Winbond Electronics |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 256M PARALLEL 84WBGA
|
Tape & Reel (TR) | - | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | 84-TFBGA | 84-WBGA (8x12.5) | Surface Mount | 256Mb (16M x 16) | SDRAM - DDR2 | DRAM | 200MHz | 400ps | ||
|
|
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Winbond Electronics |
3,360
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 84WBGA
|
Cut Tape (CT) | - | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | 84-TFBGA | 84-WBGA (8x12.5) | Surface Mount | 256Mb (16M x 16) | SDRAM - DDR2 | DRAM | 200MHz | 400ps | ||
|
|
|
Winbond Electronics |
3,360
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 84WBGA
|
- | - | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | 84-TFBGA | 84-WBGA (8x12.5) | Surface Mount | 256Mb (16M x 16) | SDRAM - DDR2 | DRAM | 200MHz | 400ps | ||
|
|
|
Winbond Electronics |
20,933
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 84WBGA
|
Tray | - | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | 84-TFBGA | 84-WBGA (8x12.5) | Surface Mount | 512Mb (32M x 16) | SDRAM - DDR2 | DRAM | 400MHz | 400ps | ||
|
|
|
Alliance Memory，Inc. |
701
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 60FPBGA
|
Tray | - | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TJ) | 60-TFBGA | 60-FPBGA (8x9) | Surface Mount | 256Mb (16M x 16) | SDRAM - Mobile LPDDR | DRAM | 166MHz | - | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
4,500
|
3 jours |
-
|
MOQ: 1500 MPQ: 1
|
IC DRAM 2G PARALLEL 96TWBGA
|
Tape & Reel (TR) | - | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | 96-TFBGA | 96-TWBGA (9x13) | Surface Mount | 2Gb (128M x 16) | SDRAM - DDR3L | DRAM | 800MHz | 20ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
6,553
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 2G PARALLEL 96TWBGA
|
Cut Tape (CT) | - | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | 96-TFBGA | 96-TWBGA (9x13) | Surface Mount | 2Gb (128M x 16) | SDRAM - DDR3L | DRAM | 800MHz | 20ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
6,553
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 2G PARALLEL 96TWBGA
|
- | - | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | 96-TFBGA | 96-TWBGA (9x13) | Surface Mount | 2Gb (128M x 16) | SDRAM - DDR3L | DRAM | 800MHz | 20ns | ||
|
|
|
Alliance Memory，Inc. |
1,812
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 66TSOP II
|
Tray | - | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | 66-TSSOP (0.400"，10.16mm Width) | 66-TSOP II | Surface Mount | 512Mb (32M x 16) | SDRAM - DDR | DRAM | 200MHz | 700ps | ||
|
|
|
Micron Technology Inc. |
6,000
|
3 jours |
-
|
MOQ: 2000 MPQ: 1
|
IC DRAM 512M PARALLEL 84FBGA
|
Tape & Reel (TR) | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | 84-TFBGA | 84-FBGA (8x12.5) | Surface Mount | 512Mb (32M x 16) | SDRAM - DDR2 | DRAM | 400MHz | 400ps | ||
|
|
|
Micron Technology Inc. |
7,562
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 84FBGA
|
Cut Tape (CT) | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | 84-TFBGA | 84-FBGA (8x12.5) | Surface Mount | 512Mb (32M x 16) | SDRAM - DDR2 | DRAM | 400MHz | 400ps | ||
|
|
|
Micron Technology Inc. |
7,562
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 84FBGA
|
- | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | 84-TFBGA | 84-FBGA (8x12.5) | Surface Mount | 512Mb (32M x 16) | SDRAM - DDR2 | DRAM | 400MHz | 400ps | ||
|
|
|
Alliance Memory，Inc. |
2,279
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 60FBGA
|
Tray | - | 1.7 V ~ 1.9 V | -40°C ~ 95°C (TC) | 60-TFBGA | 60-FBGA (8x10) | Surface Mount | 1Gb (128M x 8) | SDRAM - DDR2 | DRAM | 400MHz | 400ps | ||
|
|
|
Micron Technology Inc. |
17,277
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 60VFBGA
|
Tray | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 60-VFBGA | 60-VFBGA (8x9) | Surface Mount | 512Mb (32M x 16) | SDRAM - Mobile LPDDR | DRAM | 200MHz | 5.0ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
14,228
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 4G PARALLEL 96TWBGA
|
Tray | - | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | 96-TFBGA | 96-TWBGA (9x13) | Surface Mount | 4Gb (256M x 16) | SDRAM - DDR3L | DRAM | 800MHz | 20ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
6,157
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 2G PARALLEL 96TWBGA
|
Tray | - | 1.425 V ~ 1.575 V | -40°C ~ 95°C (TC) | 96-TFBGA | 96-TWBGA (9x13) | Surface Mount | 2Gb (128M x 16) | SDRAM - DDR3 | DRAM | 667MHz | 20ns | ||
|
|
|
Alliance Memory，Inc. |
3,230
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 4G PARALLEL 96FBGA
|
Tray | - | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | 96-TFBGA | 96-FBGA (13.5x9) | Surface Mount | 4Gb (256M x 16) | SDRAM - DDR3L | DRAM | 800MHz | 20ns | ||
|
|
|
Alliance Memory，Inc. |
1,123
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 4G PARALLEL 96FBGA
|
Tray | - | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | 96-TFBGA | 96-FBGA (13.5x9) | Surface Mount | 4Gb (256M x 16) | SDRAM - DDR3 | DRAM | 800MHz | 20ns | ||
|
|
|
Alliance Memory，Inc. |
671
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 4G PARALLEL 96FBGA
|
Tray | - | 1.425 V ~ 1.575 V | -40°C ~ 95°C (TC) | 96-TFBGA | 96-FBGA (13.5x9) | Surface Mount | 4Gb (256M x 16) | SDRAM - DDR3 | DRAM | 800MHz | 20ns | ||
|
|
|
Micron Technology Inc. |
1,794
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 60FBGA
|
Tray | - | 2.5 V ~ 2.7 V | -40°C ~ 85°C (TA) | 60-TFBGA | 60-FBGA (8x12.5) | Surface Mount | 256Mb (16M x 16) | SDRAM - DDR | DRAM | 200MHz | 700ps |
