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- Voltage - Supply：
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- Operating Temperature：
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- Supplier Device Package：
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- Mounting Type：
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- Memory Size：
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- Memory Interface：
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- Conditions sélectionnées:
Découvrez les produits 35
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Size | Technology | Clock Frequency | Memory Interface | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Size | Technology | Clock Frequency | Memory Interface | |
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GigaDevice Semiconductor (HK) Limited |
Enquête
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- |
-
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MOQ: 3000 MPQ: 1
|
SPI NAND FLASH
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Tape & Reel (TR) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | 1Gb (128M x 8) | FLASH - NAND | 120MHz | SPI - Quad I/O | ||
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GigaDevice Semiconductor (HK) Limited |
309
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
SPI NAND FLASH
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Cut Tape (CT) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | 1Gb (128M x 8) | FLASH - NAND | 120MHz | SPI - Quad I/O | ||
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GigaDevice Semiconductor (HK) Limited |
309
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
SPI NAND FLASH
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- | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | 1Gb (128M x 8) | FLASH - NAND | 120MHz | SPI - Quad I/O | ||
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GigaDevice Semiconductor (HK) Limited |
Enquête
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- |
-
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MOQ: 4800 MPQ: 1
|
SPI NAND FLASH
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Tray | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | 1Gb (128M x 8) | FLASH - NAND | 120MHz | SPI - Quad I/O | ||
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GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
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MOQ: 4800 MPQ: 1
|
SPI NAND FLASH
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Tray | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | 1Gb (128M x 8) | FLASH - NAND | 120MHz | SPI - Quad I/O | ||
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GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
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MOQ: 3000 MPQ: 1
|
SPI NAND FLASH
|
Tape & Reel (TR) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | 1Gb (128M x 8) | FLASH - NAND | 120MHz | SPI - Quad I/O | ||
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GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
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MOQ: 4800 MPQ: 1
|
SPI NAND FLASH
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Tray | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | 2Gb (256M x 8) | FLASH - NAND | 120MHz | SPI - Quad I/O | ||
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GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
|
MOQ: 4800 MPQ: 1
|
SPI NAND FLASH
|
Tray | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | 2Gb (256M x 8) | FLASH - NAND | 120MHz | SPI - Quad I/O | ||
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GigaDevice Semiconductor (HK) Limited |
Enquête
|
- |
-
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MOQ: 3000 MPQ: 1
|
SPI NAND FLASH
|
Tape & Reel (TR) | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x8) | Surface Mount | 2Gb (256M x 8) | FLASH - NAND | 120MHz | SPI - Quad I/O | ||
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Winbond Electronics |
Enquête
|
- |
-
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MOQ: 4000 MPQ: 1
|
IC FLASH 2G SPI 104MHZ 8WSON
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Tape & Reel (TR) | SpiFlash | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (8x6) | Surface Mount | 2Gb (256M x 8) | FLASH - NAND (SLC) | 104MHz | SPI | ||
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Winbond Electronics |
Enquête
|
- |
-
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MOQ: 4000 MPQ: 1
|
IC FLASH 2G SPI 104MHZ 8WSON
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Tape & Reel (TR) | SpiFlash | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-WSON (8x6) | Surface Mount | 2Gb (256M x 8) | FLASH - NAND (SLC) | 104MHz | SPI | ||
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Winbond Electronics |
Enquête
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC FLASH 2G SPI 104MHZ 24TFBGA
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Tape & Reel (TR) | SpiFlash | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 24-TBGA | 24-TFBGA (6x8) | Surface Mount | 2Gb (256M x 8) | FLASH - NAND (SLC) | 104MHz | SPI | ||
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Winbond Electronics |
Enquête
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC FLASH 2G SPI 104MHZ 24TFBGA
|
Tape & Reel (TR) | SpiFlash | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 24-TBGA | 24-TFBGA (6x8) | Surface Mount | 2Gb (256M x 8) | FLASH - NAND (SLC) | 104MHz | SPI | ||
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Winbond Electronics |
Enquête
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC FLASH 2G SPI 104MHZ 24TFBGA
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Tape & Reel (TR) | SpiFlash | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 24-TBGA | 24-TFBGA (6x8) | Surface Mount | 2Gb (256M x 8) | FLASH - NAND (SLC) | 104MHz | SPI | ||
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Winbond Electronics |
Enquête
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC FLASH 2G SPI 104MHZ 24TFBGA
|
Tape & Reel (TR) | SpiFlash | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 24-TBGA | 24-TFBGA (6x8) | Surface Mount | 2Gb (256M x 8) | FLASH - NAND (SLC) | 104MHz | SPI | ||
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ISSI，Integrated Silicon Solution Inc |
Enquête
|
- |
-
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MOQ: 0 MPQ: 1
|
IC FLASH 8M SPI 104MHZ 8WSON
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Bulk | - | 1.65 V ~ 1.95 V | -40°C ~ 105°C (TA) | 8-WDFN Exposed Pad | 8-WSON (6x5) | Surface Mount | 8Mb (1M x 8) | FLASH - NOR | 104MHz | SPI | ||
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ISSI，Integrated Silicon Solution Inc |
Enquête
|
- |
-
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MOQ: 0 MPQ: 1
|
IC FLASH 8M SPI 104MHZ 8SOIC
|
Bulk | - | 1.65 V ~ 1.95 V | -40°C ~ 105°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | 8Mb (1M x 8) | FLASH - NOR | 104MHz | SPI | ||
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ISSI，Integrated Silicon Solution Inc |
Enquête
|
- |
-
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MOQ: 0 MPQ: 1
|
IC FLASH 8M SPI 104MHZ 8SOIC
|
Bulk | - | 1.65 V ~ 1.95 V | -40°C ~ 105°C (TA) | 8-SOIC (0.209"，5.30mm Width) | 8-SOIC | Surface Mount | 8Mb (1M x 8) | FLASH - NOR | 104MHz | SPI | ||
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ISSI，Integrated Silicon Solution Inc |
Enquête
|
- |
-
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MOQ: 0 MPQ: 1
|
IC FLASH 4M SPI 104MHZ 8SOIC
|
Bulk | - | 2.3 V ~ 3.6 V | -40°C ~ 105°C (TA) | 8-SOIC (0.209"，5.30mm Width) | 8-SOIC | Surface Mount | 4Mb (512K x 8) | FLASH - NOR | 104MHz | SPI - Quad I/O | ||
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ISSI，Integrated Silicon Solution Inc |
Enquête
|
- |
-
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MOQ: 0 MPQ: 1
|
IC FLASH 4M SPI 104MHZ 8SOIC
|
Tape & Reel (TR) | - | 2.3 V ~ 3.6 V | -40°C ~ 105°C (TA) | 8-SOIC (0.209"，5.30mm Width) | 8-SOIC | Surface Mount | 4Mb (512K x 8) | FLASH - NOR | 104MHz | SPI - Quad I/O |
