- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Memory Size：
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- Clock Frequency：
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- Access Time：
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- Conditions sélectionnées:
Découvrez les produits 1,143
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Memory Size | Clock Frequency | Access Time | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Memory Size | Clock Frequency | Access Time | |
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,638
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 64M PARALLEL 54TSOP
|
Tray | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TSOP (0.400"，10.16mm Width) | 54-TSOP II | 64Mb (4M x 16) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
659
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 128M PARALLEL 54TSOP
|
Tray | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TSOP (0.400"，10.16mm Width) | 54-TSOP II | 128Mb (8M x 16) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 256M PARALLEL 54TFBGA
|
Tape & Reel (TR) | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TFBGA | 54-TFBGA (8x8) | 256Mb (16M x 16) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,872
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 54TFBGA
|
Cut Tape (CT) | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TFBGA | 54-TFBGA (8x8) | 256Mb (16M x 16) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,872
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 54TFBGA
|
- | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TFBGA | 54-TFBGA (8x8) | 256Mb (16M x 16) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
1,143
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 54TSOP
|
Tray | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TSOP (0.400"，10.16mm Width) | 54-TSOP II | 256Mb (16M x 16) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
3,765
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 54TSOP
|
Tray | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TSOP (0.400"，10.16mm Width) | 54-TSOP II | 256Mb (16M x 16) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
195
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 86TSOP II
|
Tray | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 86-TFSOP (0.400"，10.16mm Width) | 86-TSOP II | 256Mb (8M x 32) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
782
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 90TFBGA
|
Tray | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 90-TFBGA | 90-TFBGA (8x13) | 256Mb (8M x 32) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
1,262
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 90TFBGA
|
Tray | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 90-TFBGA | 90-TFBGA (8x13) | 256Mb (8M x 32) | 166MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
915
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 54TSOP
|
Tray | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 54-TSOP (0.400"，10.16mm Width) | 54-TSOP II | 512Mb (32M x 16) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
461
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 54TSOP
|
Tray | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TSOP (0.400"，10.16mm Width) | 54-TSOP II | 512Mb (32M x 16) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
1,190
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 54TSOP
|
Tray | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TSOP (0.400"，10.16mm Width) | 54-TSOP II | 512Mb (32M x 16) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC DRAM 16M PARALLEL 50TSOP II
|
Tape & Reel (TR) | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 50-TSOP (0.400"，10.16mm Width) | 50-TSOP II | 16Mb (1M x 16) | 143MHz | 5.5ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,202
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 16M PARALLEL 50TSOP II
|
Cut Tape (CT) | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 50-TSOP (0.400"，10.16mm Width) | 50-TSOP II | 16Mb (1M x 16) | 143MHz | 5.5ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
2,202
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 16M PARALLEL 50TSOP II
|
- | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 50-TSOP (0.400"，10.16mm Width) | 50-TSOP II | 16Mb (1M x 16) | 143MHz | 5.5ns | ||
|
|
|
Winbond Electronics |
3,538
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 128M PARALLEL 54TSOP
|
Tray | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 54-TSOP (0.400"，10.16mm Width) | 54-TSOP II | 128Mb (8M x 16) | 166MHz | 5ns | ||
|
|
|
Winbond Electronics |
1,420
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 54TSOP
|
Tray | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 54-TSOP (0.400"，10.16mm Width) | 54-TSOP II | 256Mb (16M x 16) | 166MHz | 5ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
1,639
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 128M PARALLEL 54TSOP
|
Tray | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 54-TSOP (0.400"，10.16mm Width) | 54-TSOP II | 128Mb (8M x 16) | 143MHz | 5.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
665
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 64M PARALLEL 86TSOP II
|
Tray | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 86-TFSOP (0.400"，10.16mm Width) | 86-TSOP II | 64Mb (2M x 32) | 143MHz | 5.4ns |
