- Packaging：
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- Series：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Memory Size：
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- Clock Frequency：
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- Memory Interface：
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- Conditions sélectionnées:
Découvrez les produits 131
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Memory Size | Clock Frequency | Access Time | Memory Interface | Write Cycle Time - Word, Page | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Memory Size | Clock Frequency | Access Time | Memory Interface | Write Cycle Time - Word, Page | |
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 135 MPQ: 1
|
IC RAM 4M PARALLEL 44TSOP II
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Tray | - | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 44-TSOP (0.400"，10.16mm Width) | 44-TSOP II | 4Mb (256K x 16) | - | 35ns | Parallel | 35ns | ||
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 1000 MPQ: 1
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IC RAM 4M PARALLEL 44TSOP II
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Tape & Reel (TR) | - | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 44-TSOP (0.400"，10.16mm Width) | 44-TSOP II | 4Mb (256K x 16) | - | 35ns | Parallel | 35ns | ||
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Everspin Technologies Inc. |
2,175
|
3 jours |
-
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MOQ: 1 MPQ: 1
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IC RAM 256K SPI 40MHZ 8DFN
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Tray | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-DFN (5x6) | 256Kb (32K x 8) | 40MHz | - | SPI | - | |||
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Everspin Technologies Inc. |
7,996
|
3 jours |
-
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MOQ: 1 MPQ: 1
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IC RAM 256K SPI 40MHZ 8DFN
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Tray | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-TDFN Exposed Pad | 8-DFN (5x6) | 256Kb (32K x 8) | 40MHz | - | SPI | - | |||
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Everspin Technologies Inc. |
5,047
|
3 jours |
-
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MOQ: 1 MPQ: 1
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IC RAM 1M SPI 40MHZ 8DFN
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Tray | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-DFN-EP，Small Flag (5x6) | 1Mb (128K x 8) | 40MHz | - | SPI | - | |||
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Everspin Technologies Inc. |
4,311
|
3 jours |
-
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MOQ: 1 MPQ: 1
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IC RAM 1M SPI 40MHZ 8DFN
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Tray | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-DFN-EP，Large Flag (5x6) | 1Mb (128K x 8) | 40MHz | - | SPI | - | |||
|
|
Everspin Technologies Inc. |
2,659
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
IC RAM 1M SPI 40MHZ 8DFN
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Tray | Automotive，AEC-Q100 | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | 8-VDFN Exposed Pad | 8-DFN-EP，Small Flag (5x6) | 1Mb (128K x 8) | 40MHz | - | SPI | - | |||
|
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Everspin Technologies Inc. |
720
|
3 jours |
-
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MOQ: 1 MPQ: 1
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IC RAM 1M SPI 40MHZ 8DFN
|
Tray | Automotive，AEC-Q100 | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | 8-TDFN Exposed Pad | 8-DFN-EP，Large Flag (5x6) | 1Mb (128K x 8) | 40MHz | - | SPI | - | |||
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Everspin Technologies Inc. |
938
|
3 jours |
-
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MOQ: 1 MPQ: 1
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IC RAM 1M PARALLEL 44TSOP2
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Tray | - | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 44-TSOP (0.400"，10.16mm Width) | 44-TSOP2 | 1Mb (64K x 16) | - | 35ns | Parallel | 35ns | |||
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Everspin Technologies Inc. |
277
|
3 jours |
-
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MOQ: 1 MPQ: 1
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IC RAM 1M PARALLEL 44TSOP2
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Tray | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 44-TSOP (0.400"，10.16mm Width) | 44-TSOP2 | 1Mb (64K x 16) | - | 35ns | Parallel | 35ns | |||
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Everspin Technologies Inc. |
2,025
|
3 jours |
-
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MOQ: 1 MPQ: 1
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IC RAM 4M SPI 40MHZ 8DFN
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Tray | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-DFN-EP，Small Flag (5x6) | 4Mb (512K x 8) | 40MHz | - | SPI | - | |||
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Everspin Technologies Inc. |
2,079
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
IC RAM 4M SPI 50MHZ 8DFN
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Tray | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-DFN-EP，Small Flag (5x6) | 4Mb (512K x 8) | 50MHz | - | SPI | - | |||
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Everspin Technologies Inc. |
602
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
IC RAM 4M PARALLEL 44TSOP2
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Tray | - | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 44-TSOP (0.400"，10.16mm Width) | 44-TSOP2 | 4Mb (256K x 16) | - | 35ns | Parallel | 35ns | |||
|
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Everspin Technologies Inc. |
5,304
|
3 jours |
-
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MOQ: 1 MPQ: 1
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IC RAM 4M PARALLEL 44TSOP2
|
Tray | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 44-TSOP (0.400"，10.16mm Width) | 44-TSOP2 | 4Mb (256K x 16) | - | 35ns | Parallel | 35ns | |||
|
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Everspin Technologies Inc. |
2,068
|
3 jours |
-
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MOQ: 1 MPQ: 1
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IC RAM 4M PARALLEL 48FBGA
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Tray | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 48-LFBGA | 48-FBGA (8x8) | 4Mb (256K x 16) | - | 35ns | Parallel | 35ns | |||
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Everspin Technologies Inc. |
1,254
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
IC RAM 4M PARALLEL 48FBGA
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Tray | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 48-LFBGA | 48-FBGA (8x8) | 4Mb (512K x 8) | - | 35ns | Parallel | 35ns | |||
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Everspin Technologies Inc. |
891
|
3 jours |
-
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MOQ: 1 MPQ: 1
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IC RAM 4M PARALLEL 44TSOP2
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Tray | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 44-TSOP (0.400"，10.16mm Width) | 44-TSOP2 | 4Mb (512K x 8) | - | 35ns | Parallel | 35ns | |||
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|
Everspin Technologies Inc. |
4,301
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
IC RAM 4M SPI 40MHZ 8DFN
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Tray | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-DFN-EP，Large Flag (5x6) | 4Mb (512K x 8) | 40MHz | - | SPI | - | |||
|
|
Everspin Technologies Inc. |
1,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC RAM 16M PARALLEL 54TSOP2
|
Tape & Reel (TR) | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TSOP (0.400"，10.16mm Width) | 54-TSOP2 | 16Mb (1M x 16) | - | 35ns | Parallel | 35ns | |||
|
|
Everspin Technologies Inc. |
1,391
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RAM 16M PARALLEL 54TSOP2
|
Cut Tape (CT) | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TSOP (0.400"，10.16mm Width) | 54-TSOP2 | 16Mb (1M x 16) | - | 35ns | Parallel | 35ns |
