- Packaging：
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- Series：
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- Operating Temperature：
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- Conditions sélectionnées:
Découvrez les produits 40
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Output Type | Number of Elements | Current - Output (Typ) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Output Type | Number of Elements | Current - Output (Typ) | |
|
Microchip Technology |
8,487
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V DUAL O-D 8-MSOP
|
Tube | - | -40°C ~ 125°C | CMOS，Open-Drain，Rail-to-Rail，TTL | 2 | 30mA | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC COMP 1.6V DUAL O-D 8MSOP
|
Tape & Reel (TR) | - | -40°C ~ 125°C | CMOS，Open-Drain，Rail-to-Rail，TTL | 2 | 30mA | |||
|
|
Microchip Technology |
4,187
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V DUAL O-D 8MSOP
|
Cut Tape (CT) | - | -40°C ~ 125°C | CMOS，Open-Drain，Rail-to-Rail，TTL | 2 | 30mA | |||
|
|
Microchip Technology |
4,187
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V DUAL O-D 8MSOP
|
- | - | -40°C ~ 125°C | CMOS，Open-Drain，Rail-to-Rail，TTL | 2 | 30mA | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC COMP PUSHPULL 1.6V DUAL 8MSOP
|
Tape & Reel (TR) | - | -40°C ~ 85°C | CMOS，Push-Pull，Rail-to-Rail，TTL | 2 | - | |||
|
|
Microchip Technology |
3,260
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP PUSHPULL 1.6V DUAL 8MSOP
|
Cut Tape (CT) | - | -40°C ~ 85°C | CMOS，Push-Pull，Rail-to-Rail，TTL | 2 | - | |||
|
|
Microchip Technology |
3,260
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP PUSHPULL 1.6V DUAL 8MSOP
|
- | - | -40°C ~ 85°C | CMOS，Push-Pull，Rail-to-Rail，TTL | 2 | - | |||
|
|
Microchip Technology |
5,602
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V DUAL P-P 8MSOP
|
Tube | - | -40°C ~ 125°C | CMOS，Push-Pull，Rail-to-Rail，TTL | 2 | - | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC COMP PP I/O SNGL 1.6V 8MSOP
|
Tape & Reel (TR) | - | -40°C ~ 85°C | CMOS，Push-Pull，Rail-to-Rail，TTL | 1 | - | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP PP I/O SNGL 1.6V 8MSOP
|
Cut Tape (CT) | - | -40°C ~ 85°C | CMOS，Push-Pull，Rail-to-Rail，TTL | 1 | - | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP PP I/O SNGL 1.6V 8MSOP
|
- | - | -40°C ~ 85°C | CMOS，Push-Pull，Rail-to-Rail，TTL | 1 | - | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC COMP 1.6V SNGL P-P 8MSOP
|
Tape & Reel (TR) | - | -40°C ~ 125°C | CMOS，Push-Pull，Rail-to-Rail，TTL | 1 | - | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V SNGL P-P 8MSOP
|
Cut Tape (CT) | - | -40°C ~ 125°C | CMOS，Push-Pull，Rail-to-Rail，TTL | 1 | - | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V SNGL P-P 8MSOP
|
- | - | -40°C ~ 125°C | CMOS，Push-Pull，Rail-to-Rail，TTL | 1 | - | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
Tape & Reel (TR) | - | -40°C ~ 85°C | CMOS，Open-Drain，Rail-to-Rail，TTL | 1 | 30mA | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
Cut Tape (CT) | - | -40°C ~ 85°C | CMOS，Open-Drain，Rail-to-Rail，TTL | 1 | 30mA | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
- | - | -40°C ~ 85°C | CMOS，Open-Drain，Rail-to-Rail，TTL | 1 | 30mA | |||
|
|
Microchip Technology |
1,342
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP OPENDRN 1.6V DUAL 8-MSOP
|
Tube | - | -40°C ~ 85°C | CMOS，Open-Drain，Rail-to-Rail，TTL | 2 | 30mA | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC COMP 1.6V DUAL P-P 8MSOP
|
Tape & Reel (TR) | - | -40°C ~ 125°C | CMOS，Push-Pull，Rail-to-Rail，TTL | 2 | - | |||
|
|
Microchip Technology |
2,336
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V DUAL P-P 8MSOP
|
Cut Tape (CT) | - | -40°C ~ 125°C | CMOS，Push-Pull，Rail-to-Rail，TTL | 2 | - |
