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Découvrez les produits 42
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Output Type | Number of Elements | Current - Output (Typ) | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Output Type | Number of Elements | Current - Output (Typ) | ||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
IC COMP OPENDRN 1.6V DUAL 8-SOIC
|
Tape & Reel (TR) | - | -40°C ~ 85°C | CMOS,Open-Drain,Rail-to-Rail,TTL | 2 | 30mA | ||||
Microchip Technology |
5,238
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP OPENDRN 1.6V DUAL 8-SOIC
|
Cut Tape (CT) | - | -40°C ~ 85°C | CMOS,Open-Drain,Rail-to-Rail,TTL | 2 | 30mA | ||||
Microchip Technology |
5,238
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP OPENDRN 1.6V DUAL 8-SOIC
|
- | - | -40°C ~ 85°C | CMOS,Open-Drain,Rail-to-Rail,TTL | 2 | 30mA | ||||
Microchip Technology |
1,061
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V DUAL P-P 8SOIC
|
Tube | - | -40°C ~ 125°C | CMOS,Push-Pull,Rail-to-Rail,TTL | 2 | - | ||||
Microchip Technology |
1,229
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP OPENDRN 1.6V DUAL 8-SOIC
|
Tube | - | -40°C ~ 85°C | CMOS,Open-Drain,Rail-to-Rail,TTL | 2 | 30mA | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
IC COMP 1.6V DUAL P-P 8SOIC
|
Tape & Reel (TR) | - | -40°C ~ 125°C | CMOS,Push-Pull,Rail-to-Rail,TTL | 2 | - | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V DUAL P-P 8SOIC
|
Cut Tape (CT) | - | -40°C ~ 125°C | CMOS,Push-Pull,Rail-to-Rail,TTL | 2 | - | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V DUAL P-P 8SOIC
|
- | - | -40°C ~ 125°C | CMOS,Push-Pull,Rail-to-Rail,TTL | 2 | - | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
IC COMP 1.6V DUAL O-D 8SOIC
|
Tape & Reel (TR) | - | -40°C ~ 125°C | CMOS,Open-Drain,Rail-to-Rail,TTL | 2 | 30mA | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V DUAL O-D 8SOIC
|
Cut Tape (CT) | - | -40°C ~ 125°C | CMOS,Open-Drain,Rail-to-Rail,TTL | 2 | 30mA | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V DUAL O-D 8SOIC
|
- | - | -40°C ~ 125°C | CMOS,Open-Drain,Rail-to-Rail,TTL | 2 | 30mA | ||||
Microchip Technology |
1,726
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP PP I/O SNGL 1.6V 8SOIC
|
Tube | - | -40°C ~ 85°C | CMOS,Push-Pull,Rail-to-Rail,TTL | 1 | - | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC COMP OPENDRN 1.6V SNGL 8-SOIC
|
Tape & Reel (TR) | - | -40°C ~ 85°C | CMOS,Open-Drain,Rail-to-Rail,TTL | 1 | 30mA | ||||
Microchip Technology |
3,295
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP OPENDRN 1.6V SNGL 8-SOIC
|
Cut Tape (CT) | - | -40°C ~ 85°C | CMOS,Open-Drain,Rail-to-Rail,TTL | 1 | 30mA | ||||
Microchip Technology |
3,295
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP OPENDRN 1.6V SNGL 8-SOIC
|
- | - | -40°C ~ 85°C | CMOS,Open-Drain,Rail-to-Rail,TTL | 1 | 30mA | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC COMP 1.6V SNGL P-P 8SOIC
|
Tape & Reel (TR) | - | -40°C ~ 125°C | CMOS,Push-Pull,Rail-to-Rail,TTL | 1 | - | ||||
Microchip Technology |
3,275
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V SNGL P-P 8SOIC
|
Cut Tape (CT) | - | -40°C ~ 125°C | CMOS,Push-Pull,Rail-to-Rail,TTL | 1 | - | ||||
Microchip Technology |
3,275
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP 1.6V SNGL P-P 8SOIC
|
- | - | -40°C ~ 125°C | CMOS,Push-Pull,Rail-to-Rail,TTL | 1 | - | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC COMP PP I/O SNGL 1.6V 8SOIC
|
Tape & Reel (TR) | - | -40°C ~ 85°C | CMOS,Push-Pull,Rail-to-Rail,TTL | 1 | - | ||||
Microchip Technology |
3,089
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC COMP PP I/O SNGL 1.6V 8SOIC
|
Cut Tape (CT) | - | -40°C ~ 85°C | CMOS,Push-Pull,Rail-to-Rail,TTL | 1 | - |