Découvrez les produits 6
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Package / Case Supplier Device Package Mounting Type
TDF8544TH/N3,118
NXP USA Inc.
Enquête
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-
MOQ: 500  MPQ: 1
IC AMP AUDIO BTL 36HSOP
Tape & Reel (TR) 36-BSSOP (0.433",11.00mm Width) Exposed Pad 36-HSOP Surface Mount
TDF8544J/N3,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AMP AUDIO BTL DBS27P
Tube 27-SIP Formed Leads DBS27P Through Hole
TDF8544TH/N2,518
NXP USA Inc.
Enquête
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-
MOQ: 500  MPQ: 1
IC PWR AMP I2C BUS CTRL HSOP36N2
Tape & Reel (TR) 36-BSSOP (0.433",11.00mm Width) Exposed Pad 36-HSOP Surface Mount
TDF8544J/N2,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AMP AUDIO BTL DBS27P
Tube 27-SIP Formed Leads DBS27P Through Hole
TDF8544SD/N3,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AMP AUDIO BTL RDBS27
Tube 27-SIP Formed Leads 27-RDBS Through Hole
TDF8544SD/N2,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC PWR AMP I2C BUS CTRL RDBS27P
Tube 27-SIP Formed Leads 27-RDBS Through Hole