- Supplier Device Package：
-
- Mounting Type：
-
- Conditions sélectionnées:
Découvrez les produits 10
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Package / Case | Supplier Device Package | Mounting Type | Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Package / Case | Supplier Device Package | Mounting Type | Features | |
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 456 MPQ: 1
|
IC AMP AUDIO BTL DBS27P
|
27-SIP Formed Leads | DBS27P | Through Hole | Depop，I2C，Mute，Short-Circuit and Thermal Protection，Standby | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 456 MPQ: 1
|
IC AMP AUDIO BTL DBS27P
|
27-SIP Formed Leads | DBS27P | Through Hole | Depop，I2C，Mute，Short-Circuit and Thermal Protection，Standby | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 456 MPQ: 1
|
IC AUDIO DEVICE DBS27P
|
27-SIP Formed Leads | DBS27P | Through Hole | Depop，Short-Circuit and Thermal Protection | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 720 MPQ: 1
|
IC AUDIO DEVICE 36HSOP
|
36-BSSOP (0.433"，11.00mm Width) Exposed Pad | 36-HSOP | Surface Mount | Depop，Short-Circuit and Thermal Protection | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 456 MPQ: 1
|
IC AUDIO DEVICE DBS27P
|
27-SIP Formed Leads | DBS27P | Through Hole | Depop，Short-Circuit and Thermal Protection | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 720 MPQ: 1
|
IC AUDIO DEVICE 36HSOP
|
36-BSSOP (0.433"，11.00mm Width) Exposed Pad | 36-HSOP | Surface Mount | Depop，Short-Circuit and Thermal Protection | |||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC AMP CLASS AB DBS27P
|
27-SIP Formed Leads | DBS27P | Through Hole | Depop，Short-Circuit and Thermal Protection | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC AMP CLASS AB RDBS27P
|
27-SIP Formed Leads | 27-RDBS | Through Hole | Depop，Short-Circuit and Thermal Protection | ||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 456 MPQ: 1
|
IC AMP AUDIO BTL RDBS27
|
27-SIP Formed Leads | 27-RDBS | Through Hole | Depop，I2C，Mute，Short-Circuit and Thermal Protection，Standby | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 456 MPQ: 1
|
IC PWR AMP I2C BUS CTRL RDBS27P
|
27-SIP Formed Leads | 27-RDBS | Through Hole | Depop，I2C，Mute，Short-Circuit and Thermal Protection，Standby |
