Découvrez les produits 11
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Voltage - Supply Package / Case Supplier Device Package Mounting Type
TDF8541JS/N3,512
NXP USA Inc.
456
3 jours
-
MOQ: 1  MPQ: 1
IC AMP AUDIO CLASS BTL 27DBSMS
6 V ~ 18 V 27-PowerSMD Module 27-DBSMSP Surface Mount
TDA8595TH/N2S,112
NXP USA Inc.
Enquête
-
-
MOQ: 720  MPQ: 1
IC AMP AUDIO I2C 45W QUAD 36HSOP
8 V ~ 18 V 36-BSSOP (0.433",11.00mm Width) Exposed Pad 36-HSOP Surface Mount
TDA8595J/N2S,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AMP AUDIO PWR QUAD SOT827
8 V ~ 18 V 27-SIP Formed Leads DBS27P Through Hole
TDA8595J/N2,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AMP AUDIO PWR 64W QUAD 27SIL
8 V ~ 18 V 27-SIP Formed Leads DBS27P Through Hole
TDA8595TH/N2C,112
NXP USA Inc.
Enquête
-
-
MOQ: 720  MPQ: 1
IC AMP AUDIO PWR 64W QUAD 36HSOP
8 V ~ 18 V 36-BSSOP (0.433",11.00mm Width) Exposed Pad 36-HSOP Surface Mount
TDF8541JS/N2,512
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AUDIO AMP BTL QUAD 27DBSMS
6 V ~ 18 V 27-PowerSMD Module 27-DBSMSP Surface Mount
TDF8541J/N3,112
NXP USA Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC AMP AUDIO CLASS BTL DBS27P
6 V ~ 18 V 27-SIP Formed Leads DBS27P Through Hole
TDA8595SD/N2,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AMP AUDIO PWR 64W QUAD 27SIL
8 V ~ 18 V 27-SIP Formed Leads 27-RDBS Through Hole
TDF8541J/N2,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AUDIO AMP BTL QUAD AB DBS27P
6 V ~ 18 V 27-SIP Formed Leads DBS27P Through Hole
TDF8541SD/N3,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AMP AUDIO BTL RDBS27
6 V ~ 18 V 27-SIP Formed Leads 27-RDBS Through Hole
TDF8541SD/N2,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AUDIO AMP BTL QUAD AB RDBS27P
6 V ~ 18 V 27-SIP Formed Leads 27-RDBS Through Hole