Packaging:
Supplier Device Package:
Découvrez les produits 8
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Supplier Device Package Mounting Type
TDF8546J/N2ZU
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AMP AUDIO BTL DBS27P
Tube DBS27P Through Hole
TDF8546AJ/N1ZU
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AMP AUDIO BTL DBS27P
Tube DBS27P Through Hole
TDF8546J/N2,112
NXP USA Inc.
220
3 jours
-
MOQ: 1  MPQ: 1
IC AMP AUDIO BTL DBS27P
Tube DBS27P Through Hole
TDF8546AJ/N1,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AMP AUDIO BTL DBS27P
Tube DBS27P Through Hole
TDF8546ASD/N1ZU
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AMP AUDIO BTL RDBS27P
Tray 27-RDBS Surface Mount
TDF8546J/N1,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AUDIO AMP I2C BUS CTRL DBS27P
Tube DBS27P Through Hole
TDF8546ASD/N1,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AMP AUDIO BTL RDBS27P
Tube 27-RDBS Surface Mount
TDF8546SD/N1,112
NXP USA Inc.
Enquête
-
-
MOQ: 456  MPQ: 1
IC AUD AMP I2C BUS CTRL RDBS27P
Tube 27-RDBS Through Hole