- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Features：
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- Max Output Power x Channels @ Load：
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- Conditions sélectionnées:
Découvrez les produits 23
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Type | Features | Output Type | Max Output Power x Channels @ Load | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Type | Features | Output Type | Max Output Power x Channels @ Load | |
|
|
|
Diodes Incorporated |
15,000
|
3 jours |
-
|
MOQ: 3000 MPQ: 1
|
IC AMP AUD 16VPP CLASS D 16UQFN
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 16-UFQFN Exposed Pad | 16-UQFN-EP (3x3) | Class D | - | 1-Channel (Mono) | - | ||
|
|
|
Diodes Incorporated |
17,817
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC AMP AUD 16VPP CLASS D 16UQFN
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 16-UFQFN Exposed Pad | 16-UQFN-EP (3x3) | Class D | - | 1-Channel (Mono) | - | ||
|
|
|
Diodes Incorporated |
17,817
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC AMP AUD 16VPP CLASS D 16UQFN
|
- | -40°C ~ 85°C (TA) | 16-UFQFN Exposed Pad | 16-UQFN-EP (3x3) | Class D | - | 1-Channel (Mono) | - | ||
|
|
|
ams |
Enquête
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC HEADPHONE AMP STER H 16-WLCSP
|
Tape & Reel (TR) | - | 16-UFBGA，WLCSP | 16-WLCSP (1.62x1.62) | Class H | Differential Inputs，I2C，Short-Circuit and Thermal Protection，Shutdown，Volume Control | Headphones，2-Channel (Stereo) | 30mW x 2 @ 16 Ohm | ||
|
|
|
ams |
335
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC HEADPHONE AMP STER H 16-WLCSP
|
Cut Tape (CT) | - | 16-UFBGA，WLCSP | 16-WLCSP (1.62x1.62) | Class H | Differential Inputs，I2C，Short-Circuit and Thermal Protection，Shutdown，Volume Control | Headphones，2-Channel (Stereo) | 30mW x 2 @ 16 Ohm | ||
|
|
|
ams |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC HEADPHONE AMP STER H 16-WLCSP
|
- | - | 16-UFBGA，WLCSP | 16-WLCSP (1.62x1.62) | Class H | Differential Inputs，I2C，Short-Circuit and Thermal Protection，Shutdown，Volume Control | Headphones，2-Channel (Stereo) | 30mW x 2 @ 16 Ohm | ||
|
|
|
ams |
Enquête
|
- |
-
|
MOQ: 6500 MPQ: 1
|
IC HEADPHONE AMP STER H 16-WLCSP
|
Tape & Reel (TR) | - | 16-UFBGA，WLCSP | 16-WLCSP (1.62x1.62) | Class H | Differential Inputs，I2C，Short-Circuit and Thermal Protection，Shutdown，Volume Control | Headphones，2-Channel (Stereo) | 30mW x 2 @ 16 Ohm | ||
|
|
|
Maxim Integrated |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC AMP AUDIO PWR .33W MONO 8TDFN
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-TDFN-EP (3x3) | Class AB | Depop，Shutdown，Thermal Protection | 1-Channel (Mono) | 330mW x 1 @ 16 Ohm | ||
|
|
|
Maxim Integrated |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC AMP AUDIO PWR .33W MONO 8TDFN
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-TDFN-EP (3x3) | Class AB | Depop，Shutdown，Thermal Protection | 1-Channel (Mono) | 330mW x 1 @ 16 Ohm | ||
|
|
|
Maxim Integrated |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC AMP AUDIO PWR .33W MONO 8TDFN
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | 8-TDFN-EP (3x3) | Class AB | Depop，Shutdown，Thermal Protection | 1-Channel (Mono) | 330mW x 1 @ 16 Ohm | ||
|
|
|
ams |
Enquête
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC HEADPHONE AMP STER H 16-WLCSP
|
Tape & Reel (TR) | - | 16-UFBGA，WLCSP | 16-WLCSP (1.62x1.62) | Class H | Differential Inputs，I2C，Short-Circuit and Thermal Protection，Shutdown，Volume Control | Headphones，2-Channel (Stereo) | 30mW x 2 @ 16 Ohm | ||
|
|
|
ams |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC HEADPHONE AMP STER H 16-WLCSP
|
Cut Tape (CT) | - | 16-UFBGA，WLCSP | 16-WLCSP (1.62x1.62) | Class H | Differential Inputs，I2C，Short-Circuit and Thermal Protection，Shutdown，Volume Control | Headphones，2-Channel (Stereo) | 30mW x 2 @ 16 Ohm | ||
|
|
|
ams |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC HEADPHONE AMP STER H 16-WLCSP
|
- | - | 16-UFBGA，WLCSP | 16-WLCSP (1.62x1.62) | Class H | Differential Inputs，I2C，Short-Circuit and Thermal Protection，Shutdown，Volume Control | Headphones，2-Channel (Stereo) | 30mW x 2 @ 16 Ohm | ||
|
|
|
ams |
Enquête
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC HEADPHONE AMP STER H 16-WLCSP
|
Tape & Reel (TR) | - | 16-UFBGA，WLCSP | 16-WLCSP (1.62x1.62) | Class H | Differential Inputs，I2C，Short-Circuit and Thermal Protection，Shutdown，Volume Control | Headphones，2-Channel (Stereo) | 30mW x 2 @ 16 Ohm | ||
|
|
ams |
500
|
3 jours |
-
|
MOQ: 500 MPQ: 1
|
IC HEADPHONE AMP STER G 16-WLCSP
|
Tape & Reel (TR) | - | 16-UFBGA，WLCSP | 16-WLCSP (1.62x1.62) | Class G | Differential Inputs，I2C，Short-Circuit and Thermal Protection，Shutdown，Volume Control | Headphones，2-Channel (Stereo) | 30mW x 2 @ 16 Ohm | |||
|
|
ams |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC HEADPHONE AMP STER G 16-WLCSP
|
Cut Tape (CT) | - | 16-UFBGA，WLCSP | 16-WLCSP (1.62x1.62) | Class G | Differential Inputs，I2C，Short-Circuit and Thermal Protection，Shutdown，Volume Control | Headphones，2-Channel (Stereo) | 30mW x 2 @ 16 Ohm | |||
|
|
ams |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC HEADPHONE AMP STER G 16-WLCSP
|
- | - | 16-UFBGA，WLCSP | 16-WLCSP (1.62x1.62) | Class G | Differential Inputs，I2C，Short-Circuit and Thermal Protection，Shutdown，Volume Control | Headphones，2-Channel (Stereo) | 30mW x 2 @ 16 Ohm | |||
|
|
|
Diodes Incorporated |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
AUDIO HIGH VOLT U-QFN3030-12 T&R
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 12-UFQFN Exposed Pad | U-QFN3030-12 | Class D | - | 1-Channel (Mono) | - | ||
|
|
|
Maxim Integrated |
Enquête
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC PREAMP MICROPHONE 4UCSP
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 4-WFBGA，CSPBGA | 4-UCSP (1.05x1.05) | Class AB | - | 1-Channel (Mono) | - | ||
|
|
|
Maxim Integrated |
Enquête
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC PREAMP MICROPHONE 4UCSP
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 4-WFBGA，CSPBGA | 4-UCSP (1.05x1.05) | Class AB | - | 1-Channel (Mono) | - |
