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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Input：
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- Output：
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- Data Rate (Max)：
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- Signal Conditioning：
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- Conditions sélectionnées:
Découvrez les produits 12
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Number of Channels | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Output | Current - Supply | Data Rate (Max) | Signal Conditioning | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Number of Channels | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Output | Current - Supply | Data Rate (Max) | Signal Conditioning | |
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NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 10000 MPQ: 1
|
IC REDRIVER USB 3.0 18DHXQFN
|
Tape & Reel (TR) | 2 | 1.7 V ~ 1.9 V | -40°C ~ 85°C | 18-XFQFN Exposed Pad | 18-X2QFN (2.4x2) | Differential | Differential | 113mA | - | Input Equalization，Output De-Emphasis | ||
|
|
|
NXP USA Inc. |
9,423
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC REDRIVER USB 3.0 18DHXQFN
|
Cut Tape (CT) | 2 | 1.7 V ~ 1.9 V | -40°C ~ 85°C | 18-XFQFN Exposed Pad | 18-X2QFN (2.4x2) | Differential | Differential | 113mA | - | Input Equalization，Output De-Emphasis | ||
|
|
|
NXP USA Inc. |
9,423
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC REDRIVER USB 3.0 18DHXQFN
|
- | 2 | 1.7 V ~ 1.9 V | -40°C ~ 85°C | 18-XFQFN Exposed Pad | 18-X2QFN (2.4x2) | Differential | Differential | 113mA | - | Input Equalization，Output De-Emphasis | ||
|
|
|
Texas Instruments |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC REDRIVER USB 3.0 18X2QFN
|
Tape & Reel (TR) | 2 | 1.62 V ~ 1.98 V | -40°C ~ 85°C | 18-XFQFN Exposed Pad | 18-X2QFN (2.4x2) | - | - | 100mA | 5Gbps | Input Equalization，Output De-Emphasis | ||
|
|
|
Texas Instruments |
3,504
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC REDRIVER USB 3.0 18X2QFN
|
Cut Tape (CT) | 2 | 1.62 V ~ 1.98 V | -40°C ~ 85°C | 18-XFQFN Exposed Pad | 18-X2QFN (2.4x2) | - | - | 100mA | 5Gbps | Input Equalization，Output De-Emphasis | ||
|
|
|
Texas Instruments |
3,504
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC REDRIVER USB 3.0 18X2QFN
|
- | 2 | 1.62 V ~ 1.98 V | -40°C ~ 85°C | 18-XFQFN Exposed Pad | 18-X2QFN (2.4x2) | - | - | 100mA | 5Gbps | Input Equalization，Output De-Emphasis | ||
|
|
|
Diodes Incorporated |
Enquête
|
- |
-
|
MOQ: 3500 MPQ: 1
|
IC REDRIVER USB 3.1 GEN-2 30TQFN
|
Tape & Reel (TR) | 1 | 3.3V | 0°C ~ 70°C | 30-WFQFN Exposed Pad | 30-TQFN (2.5x4.5) | CML | CML | - | 10Gbps | Input Equalization | ||
|
|
|
Diodes Incorporated |
2,821
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC REDRIVER USB 3.1 GEN-2 30TQFN
|
Cut Tape (CT) | 1 | 3.3V | 0°C ~ 70°C | 30-WFQFN Exposed Pad | 30-TQFN (2.5x4.5) | CML | CML | - | 10Gbps | Input Equalization | ||
|
|
|
Diodes Incorporated |
2,821
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC REDRIVER USB 3.1 GEN-2 30TQFN
|
- | 1 | 3.3V | 0°C ~ 70°C | 30-WFQFN Exposed Pad | 30-TQFN (2.5x4.5) | CML | CML | - | 10Gbps | Input Equalization | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC REDRIVER USB 3.0 18DHXQFN
|
Tape & Reel (TR) | 2 | 1.7 V ~ 1.9 V | -40°C ~ 85°C | 18-XFQFN Exposed Pad | 18-X2QFN (2.4x2) | Differential | Differential | 113mA | - | Input Equalization，Output De-Emphasis | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC REDRIVER USB 3.0 18DHXQFN
|
Cut Tape (CT) | 2 | 1.7 V ~ 1.9 V | -40°C ~ 85°C | 18-XFQFN Exposed Pad | 18-X2QFN (2.4x2) | Differential | Differential | 113mA | - | Input Equalization，Output De-Emphasis | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC REDRIVER USB 3.0 18DHXQFN
|
- | 2 | 1.7 V ~ 1.9 V | -40°C ~ 85°C | 18-XFQFN Exposed Pad | 18-X2QFN (2.4x2) | Differential | Differential | 113mA | - | Input Equalization，Output De-Emphasis |
