- Packaging：
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- Interface：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Standards：
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- Conditions sélectionnées:
Découvrez les produits 37
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Standards | Protocol | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Standards | Protocol | |
|
|
|
MaxLinear，Inc. |
450
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC G.HN CONTROLLER RGMII/SGMII
|
Tray | RGMII，SGMII | - | 0°C ~ 70°C | 28-QFN | - | G.hn | ||
|
|
|
MaxLinear，Inc. |
490
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC G.HN CONTROLLER RGMII/SGMII
|
Tray | RGMII，SGMII | - | 0°C ~ 70°C | 28-QFN | - | G.hn | ||
|
|
|
MaxLinear，Inc. |
490
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC G.HN CONTROLLER RGMII/SGMII
|
Tray | RGMII，SGMII | - | - | 28-QFN | - | G.hn | ||
|
|
|
MaxLinear，Inc. |
490
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC G.HN CONTROLLER RGMII/SGMII
|
Tray | RGMII，SGMII | - | 0°C ~ 70°C | 28-QFN | - | G.hn | ||
|
|
Microchip Technology |
5,000
|
3 jours |
-
|
MOQ: 5000 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tape & Reel (TR) | I2C | 1.8 V ~ 3.3 V | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
5,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Cut Tape (CT) | I2C | 1.8 V ~ 3.3 V | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
5,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
- | I2C | 1.8 V ~ 3.3 V | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
5,000
|
3 jours |
-
|
MOQ: 5000 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tape & Reel (TR) | I2C | 1.8 V ~ 3.3 V | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
5,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Cut Tape (CT) | I2C | 1.8 V ~ 3.3 V | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
5,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
- | I2C | 1.8 V ~ 3.3 V | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 5000 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tape & Reel (TR) | SPI | - | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
4,980
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Cut Tape (CT) | SPI | - | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
4,980
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
- | SPI | - | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
980
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | SPI | - | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
980
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | I2C | 1.8 V ~ 3.3 V | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
980
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | SPI | - | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
910
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | I2C | 1.8 V ~ 3.3 V | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
980
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | I2C | 1.8 V ~ 3.3 V | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
980
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | SPI | - | - | 28-VFQFN Exposed Pad | USB 3.0 | USB | |||
|
|
Microchip Technology |
980
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | I2C | 1.8 V ~ 3.3 V | - | 28-VFQFN Exposed Pad | USB 3.0 | USB |
