- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Peripherals：
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- Primary Attributes：
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- Core Processor：
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- RAM Size：
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- Conditions sélectionnées:
Découvrez les produits 147
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Primary Attributes | Core Processor | RAM Size | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Primary Attributes | Core Processor | RAM Size | Connectivity | |
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|
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Xilinx Inc. |
81
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 484FBGA
|
Zynq-7000 | -40°C ~ 100°C (TJ) | 484-BBGA，FCBGA | 484-FCBGA (23x23) | DMA | Kintex®-7 FPGA，125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Xilinx Inc. |
83
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 676FBGA
|
Zynq-7000 | -40°C ~ 100°C (TJ) | 676-BBGA，FCBGA | 676-FCBGA (27x27) | DMA | Kintex®-7 FPGA，125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Xilinx Inc. |
70
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 676FBGA
|
Zynq-7000 | -40°C ~ 100°C (TJ) | 676-BBGA，FCBGA | 676-FCBGA (27x27) | DMA | Kintex®-7 FPGA，125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Xilinx Inc. |
47
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 676FBGA
|
Zynq-7000 | -40°C ~ 100°C (TJ) | 676-BBGA，FCBGA | 676-FCBGA (27x27) | DMA | Kintex®-7 FPGA，350K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
81
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 188 I/O 672UBGA
|
Cyclone V SE | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | DMA，POR，WDT | FPGA - 25K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
83
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 66 I/O 484UBGA
|
Cyclone V SE | -40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) | DMA，POR，WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
38
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 145 I/O 672UBGA
|
Cyclone V SE | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | DMA，POR，WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
110
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 145 I/O 672UBGA
|
Cyclone V SX | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | DMA，POR，WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
40
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 288 I/O 896FBGA
|
Cyclone V SX | -40°C ~ 100°C (TJ) | 896-BGA | 896-FBGA (31x31) | DMA，POR，WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
59
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 288 I/O 896FBGA
|
Cyclone V ST | -40°C ~ 100°C (TJ) | 896-BGA | 896-FBGA (31x31) | DMA，POR，WDT | FPGA - 85K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
96
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 288 I/O 896FBGA
|
Cyclone V ST | -40°C ~ 100°C (TJ) | 896-BGA | 896-FBGA (31x31) | DMA，POR，WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
74
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 240 I/O 484UBGA
|
Cyclone V SE | -40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) | DMA，POR，WDT | FPGA - 25K Logic Elements | Single ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 66 I/O 484UBGA
|
Cyclone V SE | -40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) | DMA，POR，WDT | FPGA - 85K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 145 I/O 672UBGA
|
Cyclone V SE | 0°C ~ 85°C (TJ) | 672-FBGA | 672-UBGA (23x23) | DMA，POR，WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
27
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 288 I/O 896FBGA
|
Cyclone V SE | 0°C ~ 85°C (TJ) | 896-BGA | 896-FBGA (31x31) | DMA，POR，WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 145 I/O 672UBGA
|
Cyclone V SX | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | DMA，POR，WDT | FPGA - 85K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Intel |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 145 I/O 672UBGA
|
Cyclone V SE | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | DMA，POR，WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Xilinx Inc. |
36
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 676FBGA
|
Zynq-7000 | 0°C ~ 100°C (TJ) | 676-BBGA，FCBGA | 676-FCBGA (27x27) | DMA | Kintex®-7 FPGA，125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Xilinx Inc. |
27
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 900BGA
|
Zynq-7000 | -40°C ~ 100°C (TJ) | 900-BBGA，FCBGA | 900-FCBGA (31x31) | DMA | Kintex®-7 FPGA，275K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Xilinx Inc. |
26
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 900FBGA
|
Zynq-7000 | 0°C ~ 100°C (TJ) | 900-BBGA，FCBGA | 900-FCBGA (31x31) | DMA | Kintex®-7 FPGA，350K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
