- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Number of Cores/Bus Width：
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- RAM Controllers：
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Découvrez les produits 216
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | RAM Controllers | Ethernet | SATA | USB | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | RAM Controllers | Ethernet | SATA | USB | |
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|
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NXP USA Inc. |
92
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
|
|
|
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
II.MX 6S ROM PERF ENHAN
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
55
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6 SERIES 32-BIT MPU ARM CO
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
49
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
58
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
46
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6DL ROM PERF ENHAN
|
Tray | i.MX6DL | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6 SERIES 64-BIT MPU DUAL A
|
Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||
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|
|
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 852MHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6 SERIES 32-BIT MPU ARM CO
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.2GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
34
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 852MHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
57
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
57
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
232
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
235
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 800MHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 4 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ||
|
|
|
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6S ROM PERF ENHAN
|
Tray | i.MX6S | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||
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|
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NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) |
