- Packaging：
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- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Voltage - I/O：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Conditions sélectionnées:
Découvrez les produits 56
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Security Features | |
|
|
|
NXP USA Inc. |
265
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
1,520
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (14x14) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
1,424
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 529MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 529-LFBGA | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
564
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 529MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 529-LFBGA | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
166
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 529MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 529-LFBGA | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
155
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
120
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | LPDDR2，LVDDR3，DDR3 | No | Keypad，LCD | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
171
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
222
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (14x14) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | LPDDR2，LVDDR3，DDR3 | No | Keypad，LCD | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
126
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 400-LFBGA | 400-MAPBGA (14x14) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | LPDDR2，LVDDR3，DDR3 | No | Keypad，LCD | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
142
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
NO EPDC，2 ETH，NO CAN，2 OTG 1
|
Tray | i.MX7D | 0°C ~ 95°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1.0GHz | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
283
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
EPDC，2 ETH，CAN，2 OTG 1 HSIC,
|
Tray | i.MX7D | 0°C ~ 95°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1.0GHz | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
524
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
EPDC，2 ETH，CAN，2 OTG 1 HSIC,
|
Tray | i.MX7D | 0°C ~ 95°C (TJ) | 541-LFBGA | 541-MAPBGA (19x19) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1.0GHz | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
89
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU 32BIT I.MX6 800MHZ 400BGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | LPDDR2，LVDDR3，DDR3 | No | Keypad，LCD | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
90
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
40
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
NO EPDC，2 ETH，NO CAN，2 OTG 1
|
Tray | i.MX7D | -20°C ~ 105°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1.0GHz | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
90
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU 32BIT I.MX6 800MHZ 400BGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
90
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU 32BIT I.MX6 800MHZ 400BGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
77
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 7D 1.2 GHZ 19X19 MAPBGA
|
Tray | i.MX7D | 0°C ~ 85°C (TJ) | 541-LFBGA | 541-MAPBGA (19x19) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1.2GHz | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS |
