- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Speed：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- USB：
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- Conditions sélectionnées:
Découvrez les produits 136
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
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Texas Instruments |
220
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU SITARA 800MHZ 684FCBGA
|
Tray | Sitara | -40°C ~ 105°C (TJ) | 684-BFBGA，FCBGA | 684-FCBGA (23x23) | ARM® Cortex®-A8 | 1.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | DDR2，DDR3 | Yes | HDMI，HDVPSS | USB 2.0 (2) | - | ||
|
|
|
NXP USA Inc. |
936
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 800MHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
Texas Instruments |
529
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SITARA PROCESSOR
|
Tray | Sitara | -40°C ~ 105°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 1.5GHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | DDR3，SRAM | Yes | HDMI | USB 2.0 (1)，USB 3.0 (1) | - | ||
|
|
|
NXP USA Inc. |
770
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
395
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
888
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
592
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 800MHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
788
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
514
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
165
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
169
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP 1GHZ 624FCBGA
|
Tray | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
510
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP 800MHZ 624FCBGA
|
Tray | i.MX6QP | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
473
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
116
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP 1GHZ 624FCBGA
|
Tray | i.MX6DP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
Texas Instruments |
3,084
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SITARA PROCESSOR
|
Tray | Sitara | 0°C ~ 90°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 1.5GHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | DDR3，SRAM | No | - | USB 2.0 (1)，USB 3.0 (1) | - | ||
|
|
|
Texas Instruments |
356
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SITARA PROCESSOR
|
Tray | Sitara | 0°C ~ 90°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 1.5GHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | DDR3，SRAM | Yes | HDMI | USB 2.0 (1)，USB 3.0 (1) | - | ||
|
|
|
Texas Instruments |
139
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SITARA PROCESSOR
|
Tray | Sitara | 0°C ~ 90°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 500MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | DDR3，SRAM | No | - | USB 2.0 (1)，USB 3.0 (1) | - | ||
|
|
|
NXP USA Inc. |
500
|
3 jours |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tape & Reel (TR) | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
Texas Instruments |
2,874
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SITARA PROCESSOR
|
Tray | Sitara | -40°C ~ 105°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 1.5GHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | DDR3，SRAM | Yes | HDMI | USB 2.0 (1)，USB 3.0 (1) | - | ||
|
|
|
Texas Instruments |
246
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SITARA PROCESSOR
|
Tray | Sitara | -40°C ~ 105°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 1.5GHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | DDR3，SRAM | No | - | USB 2.0 (1)，USB 3.0 (1) | - |
