- Packaging：
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- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Speed：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Conditions sélectionnées:
Découvrez les produits 35
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Security Features | |
|
|
|
NXP USA Inc. |
990
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX27 400MHZ 404MAPBGA
|
Tray | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
870
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX27 400MHZ 473MAPBGA
|
Tray | i.MX27 | -40°C ~ 85°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
313
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
773
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
1,385
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
1,353
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
450
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX27 400MHZ 404MAPBGA
|
Tray | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
150
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
159
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
92
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX27 400MHZ 404MAPBGA
|
Tape & Reel (TR) | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 750 MPQ: 1
|
IC MPU I.MX27 400MHZ 473MAPBGA
|
Tape & Reel (TR) | i.MX27 | -40°C ~ 85°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MPU I.MX27 400MHZ 404MAPBGA
|
Tray | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX27 400MHZ 404MAPBGA
|
Tape & Reel (TR) | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 750 MPQ: 1
|
IC MPU I.MX27 400MHZ 473MAPBGA
|
Tape & Reel (TR) | i.MX27 | -40°C ~ 85°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 750 MPQ: 1
|
IC MPU I.MX27 400MHZ 473MAPBGA
|
Tape & Reel (TR) | i.MX27 | -40°C ~ 85°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MPU I.MX27 400MHZ 473MAPBGA
|
Tray | i.MX27 | -40°C ~ 85°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory |
