- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Ethernet：
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- USB：
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- Security Features：
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- Conditions sélectionnées:
Découvrez les produits 499
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
|
|
|
Microchip Technology |
4,000
|
3 jours |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 32BIT 64KB ROM 324TFBGA
|
Tape & Reel (TR) | SAM9G | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (15x15) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | - | LPDDR，LPSDR，DDR2，SDR，SRAM | No | LCD，Touchscreen | 10/100 Mbps | - | USB 2.0 (3) | - | ||
|
|
|
Microchip Technology |
4,283
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB ROM 324TFBGA
|
Cut Tape (CT) | SAM9G | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (15x15) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | - | LPDDR，LPSDR，DDR2，SDR，SRAM | No | LCD，Touchscreen | 10/100 Mbps | - | USB 2.0 (3) | - | ||
|
|
|
Microchip Technology |
4,283
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB ROM 324TFBGA
|
- | SAM9G | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (15x15) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | - | LPDDR，LPSDR，DDR2，SDR，SRAM | No | LCD，Touchscreen | 10/100 Mbps | - | USB 2.0 (3) | - | ||
|
|
|
Microchip Technology |
1,150
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB ROM 324TFBGA
|
Tray | SAM9G | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (15x15) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | - | LPDDR，LPSDR，DDR2，SDR，SRAM | No | LCD，Touchscreen | 10/100 Mbps | - | USB 2.0 (3) | - | ||
|
|
|
Microchip Technology |
449
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB ROM 217BGA
|
Tray | SAM9N | -40°C ~ 85°C (TA) | 217-LFBGA | 217-LFBGA (15x15) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2，SDR，SRAM | No | LCD，Touchscreen | - | - | USB 2.0 (2) | - | ||
|
|
|
NXP USA Inc. |
5,402
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX25 400MHZ 400MAPBGA
|
Tray | i.MX25 | -20°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | No | Keypad | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | - | ||
|
|
|
NXP USA Inc. |
1,764
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX25 400MHZ 400MAPBGA
|
Tray | i.MX25 | -40°C ~ 85°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | No | Keypad，LCD，Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | - | ||
|
|
|
Renesas Electronics America |
220
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LFBGA
|
Tray | RZ/A1L | -40°C ~ 85°C (TA) | 176-LFBGA | 176-LFBGA (8x8) | ARM® Cortex®-A9 | 1.2V，3.3V | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | VDC | 10/100 Mbps | - | USB 2.0 (2) | - | ||
|
|
|
NXP USA Inc. |
2,652
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 473MAPBGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
990
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX27 400MHZ 404MAPBGA
|
Tray | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 1 Core，32-Bit | Security; SAHARAH2 | DDR | Yes | Keypad，LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
415
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC52XX 400MHZ 272BGA
|
Tray | MPC52xx | 0°C ~ 70°C (TA) | 272-BBGA | 272-PBGA (27x27) | PowerPC e300 | 2.5V，3.3V | 1 Core，32-Bit | - | DDR，SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | - | ||
|
|
|
NXP USA Inc. |
495
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC52XX 400MHZ 272BGA
|
Tray | MPC52xx | -40°C ~ 85°C (TA) | 272-BBGA | 272-PBGA (27x27) | PowerPC e300 | 2.5V，3.3V | 1 Core，32-Bit | - | DDR，SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | - | ||
|
|
|
NXP USA Inc. |
734
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | - | ||
|
|
|
Renesas Electronics America |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 449FBGA
|
Tray | - | -20°C ~ 75°C (TA) | 449-FBGA | 449-FBGA (21x21) | SH-4A | - | - | - | - | - | - | - | - | - | - | ||
|
|
|
Microchip Technology |
268
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB ROM 217BGA
|
Tray | SAM9G | -40°C ~ 85°C (TA) | 217-LFBGA | 217-LFBGA (15x15) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | - | DDR2，SDRAM，SRAM | No | LCD，Touchscreen | 10/100 Mbps | - | USB 2.0 (3) | - | ||
|
|
|
Renesas Electronics America |
164
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LFQFP
|
Tray | RZ/A1L | -40°C ~ 85°C (TA) | 176-LQFP | 176-LFQFP (24x24) | ARM® Cortex®-A9 | 1.2V，3.3V | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | VDC | 10/100 Mbps | - | USB 2.0 (2) | - | ||
|
|
|
NXP USA Inc. |
870
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX27 400MHZ 473MAPBGA
|
Tray | i.MX27 | -40°C ~ 85°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 1 Core，32-Bit | Security; SAHARAH2 | DDR | Yes | Keypad，LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
420
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 473MAPBGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
339
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC52XX 400MHZ 272BGA
|
Tray | MPC52xx | -40°C ~ 85°C (TA) | 272-BBGA | 272-PBGA (27x27) | PowerPC G2_LE | 2.5V，3.3V | 1 Core，32-Bit | - | DDR，SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | - | ||
|
|
|
NXP USA Inc. |
385
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 620BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300 | 2.5V，3.3V | 1 Core，32-Bit | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | - |
