- Packaging:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Voltage - I/O:
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- Speed:
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- Number of Cores/Bus Width:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Ethernet:
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- Conditions sélectionnées:
Découvrez les produits 193
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Ethernet | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Ethernet | Security Features | ||
NXP USA Inc. |
2,652
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 473MAPBGA
|
Tray | MPC83XX | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 400MHz | 1 Core,32-Bit | - | DDR2 | 10/100/1000 Mbps (3) | - | ||||
NXP USA Inc. |
305
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
1,260
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 473MAPBGA
|
Tray | MPC83XX | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 266MHz | 1 Core,32-Bit | - | DDR2 | 10/100/1000 Mbps (3) | - | ||||
NXP USA Inc. |
40
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
139
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 369BGA
|
Tray | MPC83XX | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | 266MHz | 1 Core,32-Bit | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
40
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
29
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
|
Tray | MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 333MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
74
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (2) | - | ||||
NXP USA Inc. |
74
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (2) | - | ||||
NXP USA Inc. |
19
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
15
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
3
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 473MAPBGA
|
Tray | MPC83XX | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 333MHz | 1 Core,32-Bit | - | DDR2 | 10/100/1000 Mbps (3) | - | ||||
NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 489BGA
|
Tray | MPC83XX | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | 333MHz | 1 Core,32-Bit | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
18
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 489BGA
|
Tray | MPC83XX | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | 400MHz | 1 Core,32-Bit | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
39
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 516BGA
|
Tray | MPC83XX | 516-BBGA | 516-FPBGA (27x27) | PowerPC e300c2 | 1.8V,2.5V,3.3V | 266MHz | 1 Core,32-Bit | Communications; QUICC Engine | DDR,DDR2 | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
40
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
Tray | MPC83XX | 516-BBGA | 516-FPBGA (27x27) | PowerPC e300c2 | 1.8V,2.5V,3.3V | 333MHz | 1 Core,32-Bit | Communications; QUICC Engine,Security; SEC 2.2 | DDR,DDR2 | 10/100 Mbps (3) | Cryptography | ||||
NXP USA Inc. |
39
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | 10/100 Mbps (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
40
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 516BGA
|
Tray | MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 300MHz | 1 Core,32-Bit | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | 10/100 Mbps (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
40
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | 1 Core,32-Bit | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | 10/100 Mbps (2) | Cryptography,Random Number Generator |