- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Voltage - I/O：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- RAM Controllers：
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- SATA：
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- Conditions sélectionnées:
Découvrez les produits 221
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
|
|
|
NXP USA Inc. |
34
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | 1 Core，32-Bit | - | DDR2，DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | ||
|
|
|
NXP USA Inc. |
61
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
Tray | 0°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1.055GHz | 2 Core，32-Bit | Security; SEC | DDR2，DDR3 | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | - | 800MHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
34
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | - | 1.0GHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | - | 1.0GHz | 1 Core，32-Bit | Security; SEC 4.4 | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | Boot Security，Cryptography，Random Number Generator，Secure Fusebox | ||
|
|
|
NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | - | 1.0GHz | 1 Core，32-Bit | Security; SEC 4.4 | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | Boot Security，Cryptography，Random Number Generator，Secure Fusebox | ||
|
|
|
NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 425TEBGA
|
Tray | -40°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | - | 800MHz | 1 Core，32-Bit | Security; SEC 4.4 | DDR3，DDR3L | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | Boot Security，Cryptography，Random Number Generator，Secure Fusebox | ||
|
|
|
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | 1 Core，32-Bit | - | DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | ||
|
|
|
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | 1 Core，32-Bit | Security; SEC 3.3 | DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | -40°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | - | 1.0GHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | -40°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | - | 1.0GHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | -40°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | - | 1.0GHz | 1 Core，32-Bit | Security; SEC 4.4 | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | Boot Security，Cryptography，Random Number Generator，Secure Fusebox | ||
|
|
|
NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | -40°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | - | 1.0GHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
27
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | 1 Core，32-Bit | Communications; QUICC Engine | DDR2，DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | ||
|
|
|
NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | -40°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | - | 1.0GHz | 1 Core，32-Bit | Security; SEC 4.4 | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | Boot Security，Cryptography，Random Number Generator，Secure Fusebox | ||
|
|
|
NXP USA Inc. |
54
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | 2 Core，32-Bit | Communications; QUICC Engine，Security; SEC 3.3 | DDR2，DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
5
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | 1 Core，32-Bit | Security; SEC 3.3 | DDR2，DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
3
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | 1 Core，32-Bit | Security; SEC 3.3 | DDR2，DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | - | 800MHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | - | 800MHz | 1 Core，32-Bit | Security; SEC 4.4 | DDR3，DDR3L | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | Boot Security，Cryptography，Random Number Generator，Secure Fusebox |
