- Series:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Number of Gates:
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- Number of I/O:
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- Number of Logic Elements/Cells:
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- Conditions sélectionnées:
Découvrez les produits 464
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Number of Gates | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Number of Gates | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | ||
Intel |
2,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | - | 27 | 125 | 2000 | ||||
Intel |
2,433
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | - | 27 | 125 | 2000 | ||||
Intel |
2,433
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | - | 27 | 125 | 2000 | ||||
Intel |
6,972
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | - | 130 | 125 | 2000 | ||||
Intel |
7,670
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
MAX 10 | 2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | - | 101 | 125 | 2000 | ||||
Intel |
308
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 112 I/O 153MBGA
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 153-VFBGA | 153-MBGA (8x8) | - | 112 | 125 | 2000 | ||||
Intel |
337
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 160 I/O 324UBGA
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | - | 160 | 125 | 2000 | ||||
Intel |
3,211
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | - | 130 | 125 | 2000 | ||||
Intel |
648
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | - | 101 | 125 | 2000 | ||||
Intel |
1,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | - | 27 | 125 | 2000 | ||||
Intel |
1,260
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | - | 27 | 125 | 2000 | ||||
Intel |
1,260
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | - | 27 | 125 | 2000 | ||||
Intel |
352
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 125°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | - | 130 | 125 | 2000 | ||||
Intel |
175
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 125°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | - | 101 | 125 | 2000 | ||||
Intel |
94
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 160 I/O 324UBGA
|
MAX 10 | 1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | - | 160 | 125 | 2000 | ||||
Intel |
50
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
324-PIN UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | - | 130 | 125 | 2000 | ||||
Intel |
23
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 112 I/O 153MBGA
|
MAX 10 | 2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 153-VFBGA | 153-MBGA (8x8) | - | 112 | 125 | 2000 | ||||
Intel |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | - | 27 | 125 | 2000 | ||||
Intel |
Enquête
|
- |
-
|
MOQ: 119 MPQ: 1
|
IC FPGA 160 I/O 324UBGA
|
MAX 10 | 1.15 V ~ 1.25 V | -40°C ~ 125°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | - | 160 | 125 | 2000 | ||||
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 235 I/O 484FBGA
|
IGLOO | 1.425 V ~ 1.575 V | 0°C ~ 70°C (TA) | 484-BGA | 484-FPBGA (23x23) | 600000 | 235 | - | 13824 |