Découvrez les produits 26
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Series Operating Temperature Package / Case Supplier Device Package Number of I/O
XCV600-4FG676C
Xilinx Inc.
Enquête
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-
MOQ: 2  MPQ: 1
IC FPGA 444 I/O 676FBGA
Virtex 0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV600-4FG676I
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 444 I/O 676FBGA
Virtex -40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV600-5FG676C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 444 I/O 676FBGA
Virtex 0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV600-5FG676I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 444 I/O 676FBGA
Virtex -40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV600-6FG676C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 444 I/O 676FBGA
Virtex 0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV600-4BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 316 I/O 432MBGA
Virtex 0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 316
XCV600-4BG432I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 316 I/O 432MBGA
Virtex -40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 316
XCV600-4BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 404 I/O 560MBGA
Virtex 0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV600-4BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
Virtex -40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV600-4FG680C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
Virtex 0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV600-4FG680I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
Virtex -40°C ~ 100°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV600-4HQ240C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 166 I/O 240HQFP
Virtex 0°C ~ 85°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 166
XCV600-4HQ240I
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 166 I/O 240HQFP
Virtex -40°C ~ 100°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 166
XCV600-5BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 316 I/O 432MBGA
Virtex 0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 316
XCV600-5BG432I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 316 I/O 432MBGA
Virtex -40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 316
XCV600-5BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
Virtex 0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV600-5BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
Virtex -40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV600-5FG680C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
Virtex 0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV600-5FG680I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
Virtex -40°C ~ 100°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV600-5HQ240C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 166 I/O 240HQFP
Virtex 0°C ~ 85°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 166