Supplier Device Package:
Number of I/O:
Découvrez les produits 8
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Operating Temperature Package / Case Supplier Device Package Number of I/O
5AGZME3E3H29C4N
Intel
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 342 I/O 780HBGA
0°C ~ 85°C (TJ) 780-BBGA,FCBGA 780-HBGA (33x33) 342
5AGZME3H3F35C4N
Intel
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 414 I/O 1152FBGA
0°C ~ 85°C (TJ) 1152-BBGA,FCBGA 1152-FBGA (35x35) 414
5AGZME3E2H29C3N
Intel
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 342 I/O 780HBGA
0°C ~ 85°C (TJ) 780-BBGA,FCBGA 780-HBGA (33x33) 342
5AGZME3E3H29I4N
Intel
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 342 I/O 780HBGA
-40°C ~ 100°C (TJ) 780-BBGA,FCBGA 780-HBGA (33x33) 342
5AGZME3H2F35C3N
Intel
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 414 I/O 1152FBGA
0°C ~ 85°C (TJ) 1152-BBGA,FCBGA 1152-FBGA (35x35) 414
5AGZME3H3F35I4N
Intel
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 414 I/O 1152FBGA
-40°C ~ 100°C (TJ) 1152-BBGA,FCBGA 1152-FBGA (35x35) 414
5AGZME3E2H29I3LN
Intel
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 342 I/O 780HBGA
-40°C ~ 100°C (TJ) 780-BBGA,FCBGA 780-HBGA (33x33) 342
5AGZME3H2F35I3LN
Intel
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 414 I/O 1152FBGA
-40°C ~ 100°C (TJ) 1152-BBGA,FCBGA 1152-FBGA (35x35) 414