Découvrez les produits 11
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Operating Temperature Package / Case Supplier Device Package Number of I/O
XC3S1400AN-5FGG676C
Xilinx Inc.
234
3 jours
-
MOQ: 1  MPQ: 1
IC FPGA 502 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27) 502
XC3S1400AN-4FGG676C
Xilinx Inc.
Enquête
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27) 502
XC3S1400AN-4FGG676I
Xilinx Inc.
Enquête
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BGA 676-FBGA (27x27) 502
XC3S1400AN-4FG676C
Xilinx Inc.
Enquête
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 502
XC3S1400AN-4FG676I
Xilinx Inc.
Enquête
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 502
XC3S1400AN-4FGG484C
Xilinx Inc.
Enquête
-
-
MOQ: 6  MPQ: 1
IC FPGA 372 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BBGA 484-FBGA (23x23) 372
XC3S1400AN-4FGG484I
Xilinx Inc.
Enquête
-
-
MOQ: 5  MPQ: 1
IC FPGA 372 I/O 484FBGA
-40°C ~ 100°C (TJ) 484-BBGA 484-FBGA (23x23) 372
XC3S1400AN-5FGG484C
Xilinx Inc.
Enquête
-
-
MOQ: 5  MPQ: 1
IC FPGA 372 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BBGA 484-FBGA (23x23) 372
XC3S1400AN-4FG484C
Xilinx Inc.
Enquête
-
-
MOQ: 6  MPQ: 1
IC FPGA 372 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BBGA 484-FBGA (23x23) 372
XC3S1400AN-4FG484I
Xilinx Inc.
Enquête
-
-
MOQ: 5  MPQ: 1
IC FPGA 372 I/O 484FBGA
-40°C ~ 100°C (TJ) 484-BBGA 484-FBGA (23x23) 372
XC3S1400AN-5FG484C
Xilinx Inc.
Enquête
-
-
MOQ: 5  MPQ: 1
IC FPGA 372 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BBGA 484-FBGA (23x23) 372