- Series：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Total RAM Bits：
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- Conditions sélectionnées:
Découvrez les produits 29
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Number of Logic Elements/Cells | Total RAM Bits | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Number of Logic Elements/Cells | Total RAM Bits | |
|
|
|
Intel |
2,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 36-UFBGA，WLCSP | 36-WLCSP (3x3) | 27 | 2000 | 110592 | ||
|
|
|
Intel |
2,433
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 36-UFBGA，WLCSP | 36-WLCSP (3x3) | 27 | 2000 | 110592 | ||
|
|
|
Intel |
2,433
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 36-UFBGA，WLCSP | 36-WLCSP (3x3) | 27 | 2000 | 110592 | ||
|
|
|
Intel |
6,972
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 2000 | 110592 | ||
|
|
|
Intel |
7,670
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
MAX 10 | 2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 2000 | 110592 | ||
|
|
|
Intel |
308
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 112 I/O 153MBGA
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 153-VFBGA | 153-MBGA (8x8) | 112 | 2000 | 110592 | ||
|
|
|
Intel |
337
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 160 I/O 324UBGA
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 160 | 2000 | 110592 | ||
|
|
|
Intel |
3,211
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 2000 | 110592 | ||
|
|
|
Intel |
648
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 2000 | 110592 | ||
|
|
|
Intel |
1,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 36-UFBGA，WLCSP | 36-WLCSP (3x3) | 27 | 2000 | 110592 | ||
|
|
|
Intel |
1,260
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 36-UFBGA，WLCSP | 36-WLCSP (3x3) | 27 | 2000 | 110592 | ||
|
|
|
Intel |
1,260
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 36-UFBGA，WLCSP | 36-WLCSP (3x3) | 27 | 2000 | 110592 | ||
|
|
|
Intel |
352
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 125°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 2000 | 110592 | ||
|
|
|
Intel |
175
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 125°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 2000 | 110592 | ||
|
|
|
Lattice Semiconductor Corporation |
485
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 28 I/O 36UCBGA
|
LM | 1.14 V ~ 1.26 V | -40°C ~ 100°C (TJ) | 36-VFBGA | 36-UCBGA (2.5x2.5) | 28 | 1000 | 65536 | ||
|
|
|
Intel |
94
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 160 I/O 324UBGA
|
MAX 10 | 1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 160 | 2000 | 110592 | ||
|
|
|
Lattice Semiconductor Corporation |
50
|
3 jours |
-
|
MOQ: 50 MPQ: 1
|
IC FPGA 18 I/O 25WLCSP
|
LM | 1.14 V ~ 1.26 V | -40°C ~ 100°C (TJ) | 25-XFBGA，WLCSP | 25-WLCSP (1.7x1.7) | 18 | 1000 | 65536 | ||
|
|
|
Lattice Semiconductor Corporation |
91
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 18 I/O 25WLCSP
|
LM | 1.14 V ~ 1.26 V | -40°C ~ 100°C (TJ) | 25-XFBGA，WLCSP | 25-WLCSP (1.7x1.7) | 18 | 1000 | 65536 | ||
|
|
|
Lattice Semiconductor Corporation |
91
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 18 I/O 25WLCSP
|
LM | 1.14 V ~ 1.26 V | -40°C ~ 100°C (TJ) | 25-XFBGA，WLCSP | 25-WLCSP (1.7x1.7) | 18 | 1000 | 65536 | ||
|
|
|
Intel |
50
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
324-PIN UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 130 | 2000 | 110592 |
