- Series:
-
- Voltage - Supply:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Total RAM Bits:
-
- Conditions sélectionnées:
Découvrez les produits 43
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Number of Logic Elements/Cells | Total RAM Bits | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Number of Logic Elements/Cells | Total RAM Bits | ||
Intel |
2,840
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 4000 | 193536 | ||||
Intel |
1,040
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
MAX 10 | 2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 4000 | 193536 | ||||
Intel |
2,059
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 4000 | 193536 | ||||
Intel |
346
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | 4000 | 193536 | ||||
Intel |
3,167
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 4000 | 193536 | ||||
Intel |
931
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 112 I/O 153MBGA
|
MAX 10 | 2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 153-VFBGA | 153-MBGA (8x8) | 112 | 4000 | 193536 | ||||
Intel |
2,079
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 4000 | 193536 | ||||
Intel |
172
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
MAX 10 | 2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 4000 | 193536 | ||||
Intel |
1,047
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | 4000 | 193536 | ||||
Intel |
219
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 4000 | 193536 | ||||
Intel |
1,482
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 4000 | 193536 | ||||
Intel |
281
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 246 I/O 324UBGA
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 246 | 4000 | 193536 | ||||
Intel |
176
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
MAX 10 | 2.85 V ~ 3.465 V | -40°C ~ 125°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 4000 | 193536 | ||||
Intel |
505
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 246 I/O 324UBGA
|
MAX 10 | 1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 246 | 4000 | 193536 | ||||
Lattice Semiconductor Corporation |
161
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 28 I/O 36UCBGA
|
LM | 1.14 V ~ 1.26 V | -40°C ~ 100°C (TJ) | 36-VFBGA | 36-UCBGA (2.5x2.5) | 28 | 2000 | 81920 | ||||
Lattice Semiconductor Corporation |
261
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 37 I/O 49UCBGA
|
LM | 1.14 V ~ 1.26 V | -40°C ~ 100°C (TJ) | 49-VFBGA | 49-UCBGA (3x3) | 37 | 2000 | 81920 | ||||
Intel |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
MAX 10 | 1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | 4000 | 193536 | ||||
Lattice Semiconductor Corporation |
50
|
3 jours |
-
|
MOQ: 50 MPQ: 1
|
IC FPGA 18 I/O 25WLCSP
|
LM | 1.14 V ~ 1.26 V | -40°C ~ 100°C (TJ) | 25-XFBGA,WLCSP | 25-WLCSP (1.7x1.7) | 18 | 2000 | 81920 | ||||
Lattice Semiconductor Corporation |
50
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 18 I/O 25WLCSP
|
LM | 1.14 V ~ 1.26 V | -40°C ~ 100°C (TJ) | 25-XFBGA,WLCSP | 25-WLCSP (1.7x1.7) | 18 | 2000 | 81920 | ||||
Lattice Semiconductor Corporation |
50
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 18 I/O 25WLCSP
|
LM | 1.14 V ~ 1.26 V | -40°C ~ 100°C (TJ) | 25-XFBGA,WLCSP | 25-WLCSP (1.7x1.7) | 18 | 2000 | 81920 |