- Series:
-
- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
-
Découvrez les produits 79
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
Intel |
1,577
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 165 I/O 256FBGA
|
Cyclone IV E | 0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 165 | ||||
Intel |
355
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 84 I/O 144EQFP
|
Cyclone III | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 84 | ||||
Intel |
308
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 343 I/O 484FBGA
|
Cyclone IV E | 0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 343 | ||||
Intel |
375
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 81 I/O 144EQFP
|
Cyclone IV E | -40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 81 | ||||
Intel |
656
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 165 I/O 256FBGA
|
Cyclone IV E | 0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 165 | ||||
Intel |
2,487
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 160 I/O 240QFP
|
Cyclone III | 0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) | 160 | ||||
Intel |
308
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 160 I/O 240QFP
|
Cyclone III | 0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) | 160 | ||||
Intel |
316
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 89 I/O 164MBGA
|
Cyclone IV E | -40°C ~ 100°C (TJ) | 164-TFBGA | 164-MBGA (8x8) | 89 | ||||
Intel |
566
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 168 I/O 256FBGA
|
Cyclone III | 0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 168 | ||||
Intel |
226
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 165 I/O 256UBGA
|
Cyclone IV E | -40°C ~ 100°C (TJ) | 256-LFBGA | 256-UBGA (14x14) | 165 | ||||
Intel |
176
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 168 I/O 256UBGA
|
Cyclone III | 0°C ~ 85°C (TJ) | 256-LFBGA | 256-UBGA (14x14) | 168 | ||||
Intel |
141
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 84 I/O 144EQFP
|
Cyclone III | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 84 | ||||
Intel |
500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 346 I/O 484FBGA
|
Cyclone III | 0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 346 | ||||
Intel |
489
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 165 I/O 256FBGA
|
Cyclone IV E | -40°C ~ 100°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 165 | ||||
Intel |
1,909
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 168 I/O 256FBGA
|
Cyclone III | 0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 168 | ||||
Intel |
120
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 343 I/O 484FBGA
|
Cyclone IV E | -40°C ~ 100°C (TJ) | 484-BGA | 484-FBGA (23x23) | 343 | ||||
Intel |
319
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 92 I/O 164MBGA
|
Cyclone III | -40°C ~ 100°C (TJ) | 164-TFBGA | 164-MBGA (8x8) | 92 | ||||
Intel |
106
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 168 I/O 256FBGA
|
Cyclone III | 0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 168 | ||||
Intel |
161
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 346 I/O 484FBGA
|
Cyclone III | 0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 346 | ||||
Intel |
162
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 81 I/O 144EQFP
|
Cyclone IV E | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 81 |