Supplier Device Package:
Number of Gates:
Number of LABs/CLBs:
Number of Logic Elements/Cells:
Total RAM Bits:
Découvrez les produits 28
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Operating Temperature Package / Case Supplier Device Package Number of Gates Number of LABs/CLBs Number of Logic Elements/Cells Total RAM Bits
XC4052XL-1BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 52000 1936 4598 61952
XC4052XL-1BG432I
Xilinx Inc.
Enquête
-
-
MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 52000 1936 4598 61952
XC4052XL-1BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 12  MPQ: 1
IC FPGA 352 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 52000 1936 4598 61952
XC4052XL-1BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 12  MPQ: 1
IC FPGA 352 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 52000 1936 4598 61952
XC4052XL-2BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 52000 1936 4598 61952
XC4052XL-2BG432I
Xilinx Inc.
Enquête
-
-
MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 52000 1936 4598 61952
XC4052XL-2BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 12  MPQ: 1
IC FPGA 352 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 52000 1936 4598 61952
XC4052XL-2BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 12  MPQ: 1
IC FPGA 352 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 52000 1936 4598 61952
XC4052XL-3BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 52000 1936 4598 61952
XC4052XL-3BG432I
Xilinx Inc.
Enquête
-
-
MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 52000 1936 4598 61952
XC4052XL-3BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 12  MPQ: 1
IC FPGA 352 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 52000 1936 4598 61952
XC4052XL-3BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 12  MPQ: 1
IC FPGA 352 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 52000 1936 4598 61952
XC4062XL-09BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 352 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 62000 2304 5472 73728
XC4062XL-1BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 352 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 62000 2304 5472 73728
XC4062XL-1BG432I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 352 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 62000 2304 5472 73728
XC4062XL-2BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 352 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 62000 2304 5472 73728
XC4062XL-2BG432I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 352 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 62000 2304 5472 73728
XC4062XL-3BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 352 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 62000 2304 5472 73728
XC4062XL-3BG432I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 352 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 62000 2304 5472 73728
XC4085XL-1BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 85000 3136 7448 100352