- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Conditions sélectionnées:
Découvrez les produits 14
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | ||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 256 I/O 304HQFP
|
0°C ~ 85°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 256 I/O 304HQFP
|
-40°C ~ 100°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 256 I/O 304HQFP
|
0°C ~ 85°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 256 I/O 304HQFP
|
-40°C ~ 100°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 256 I/O 304HQFP
|
0°C ~ 85°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 256 I/O 304HQFP
|
-40°C ~ 100°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 256 I/O 352MBGA
|
0°C ~ 85°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 256 I/O 304HQFP
|
0°C ~ 85°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC FPGA 256 I/O 352MBGA
|
0°C ~ 85°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC FPGA 256 I/O 352MBGA
|
-40°C ~ 100°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC FPGA 256 I/O 352MBGA
|
0°C ~ 85°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC FPGA 256 I/O 352MBGA
|
-40°C ~ 100°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 3 MPQ: 1
|
IC FPGA 256 I/O 352MBGA
|
0°C ~ 85°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC FPGA 256 I/O 352MBGA
|
-40°C ~ 100°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) |