Supplier Device Package:
Number of Gates:
Number of LABs/CLBs:
Number of Logic Elements/Cells:
Total RAM Bits:
Découvrez les produits 20
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Operating Temperature Package / Case Supplier Device Package Number of Gates Number of LABs/CLBs Number of Logic Elements/Cells Total RAM Bits
XCV150-4FG456C
Xilinx Inc.
Enquête
-
-
MOQ: 60  MPQ: 1
IC FPGA 260 I/O 456FBGA
0°C ~ 85°C (TJ) 456-BBGA 456-FBGA (23x23) 164674 864 3888 49152
XCV150-4FG456I
Xilinx Inc.
Enquête
-
-
MOQ: 60  MPQ: 1
IC FPGA 260 I/O 456FBGA
-40°C ~ 100°C (TJ) 456-BBGA 456-FBGA (23x23) 164674 864 3888 49152
XCV150-5FG456C
Xilinx Inc.
Enquête
-
-
MOQ: 60  MPQ: 1
IC FPGA 260 I/O 456FBGA
0°C ~ 85°C (TJ) 456-BBGA 456-FBGA (23x23) 164674 864 3888 49152
XCV150-5FG456I
Xilinx Inc.
Enquête
-
-
MOQ: 60  MPQ: 1
IC FPGA 260 I/O 456FBGA
-40°C ~ 100°C (TJ) 456-BBGA 456-FBGA (23x23) 164674 864 3888 49152
XCV150-6FG456C
Xilinx Inc.
Enquête
-
-
MOQ: 60  MPQ: 1
IC FPGA 260 I/O 456FBGA
0°C ~ 85°C (TJ) 456-BBGA 456-FBGA (23x23) 164674 864 3888 49152
XCV150-4BG352C
Xilinx Inc.
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 260 I/O 352MBGA
0°C ~ 85°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 164674 864 3888 49152
XCV150-4BG352I
Xilinx Inc.
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 260 I/O 352MBGA
-40°C ~ 100°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 164674 864 3888 49152
XCV150-5BG352C
Xilinx Inc.
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 260 I/O 352MBGA
0°C ~ 85°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 164674 864 3888 49152
XCV150-5BG352I
Xilinx Inc.
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 260 I/O 352MBGA
-40°C ~ 100°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 164674 864 3888 49152
XCV150-6BG352C
Xilinx Inc.
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 260 I/O 352MBGA
0°C ~ 85°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 164674 864 3888 49152
XCV200-4BG352C
Xilinx Inc.
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 260 I/O 352MBGA
0°C ~ 85°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 236666 1176 5292 57344
XCV200-4BG352I
Xilinx Inc.
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 260 I/O 352MBGA
-40°C ~ 100°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 236666 1176 5292 57344
XCV200-5BG352C
Xilinx Inc.
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 260 I/O 352MBGA
0°C ~ 85°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 236666 1176 5292 57344
XCV200-5BG352I
Xilinx Inc.
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 260 I/O 352MBGA
-40°C ~ 100°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 236666 1176 5292 57344
XCV200-6BG352C
Xilinx Inc.
Enquête
-
-
MOQ: 3  MPQ: 1
IC FPGA 260 I/O 352MBGA
0°C ~ 85°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 236666 1176 5292 57344
XCV300-4BG352C
Xilinx Inc.
Enquête
-
-
MOQ: 24  MPQ: 1
IC FPGA 260 I/O 352MBGA
0°C ~ 85°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 322970 1536 6912 65536
XCV300-4BG352I
Xilinx Inc.
Enquête
-
-
MOQ: 3  MPQ: 1
IC FPGA 260 I/O 352MBGA
-40°C ~ 100°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 322970 1536 6912 65536
XCV300-5BG352C
Xilinx Inc.
Enquête
-
-
MOQ: 3  MPQ: 1
IC FPGA 260 I/O 352MBGA
0°C ~ 85°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 322970 1536 6912 65536
XCV300-5BG352I
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 260 I/O 352MBGA
-40°C ~ 100°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 322970 1536 6912 65536
XCV300-6BG352C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 260 I/O 352MBGA
0°C ~ 85°C (TJ) 352-LBGA Exposed Pad,Metal 352-MBGA (35x35) 322970 1536 6912 65536