Découvrez les produits 29
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Operating Temperature Package / Case Supplier Device Package Number of I/O
XCV600E-6FG676C
Xilinx Inc.
Enquête
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-
MOQ: 2  MPQ: 1
IC FPGA 444 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV600E-6FG676I
Xilinx Inc.
Enquête
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-
MOQ: 2  MPQ: 1
IC FPGA 444 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV600E-6FG900C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 512 I/O 900FBGA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 512
XCV600E-6FG900I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 900FBGA
-40°C ~ 100°C (TJ) 900-BBGA 900-FBGA (31x31) 512
XCV600E-7FG676C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 444 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV600E-7FG676I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 444 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV600E-7FG900C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 900FBGA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 512
XCV600E-7FG900I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 900FBGA
-40°C ~ 100°C (TJ) 900-BBGA 900-FBGA (31x31) 512
XCV600E-8FG676C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 444 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV600E-8FG900C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 900FBGA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 512
XCV600E-6BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 316 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 316
XCV600E-6BG432I
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 316 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 316
XCV600E-6BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV600E-6BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 404 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV600E-6FG680C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 512 I/O 680FBGA
0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV600E-6HQ240C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 158 I/O 240HQFP
0°C ~ 85°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 158
XCV600E-6HQ240I
Xilinx Inc.
Enquête
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-
MOQ: 2  MPQ: 1
IC FPGA 158 I/O 240HQFP
-40°C ~ 100°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 158
XCV600E-7BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 316 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 316
XCV600E-7BG432I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 316 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 316
XCV600E-7BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404