- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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Découvrez les produits 7
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of Gates | Number of I/O | Total RAM Bits | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of Gates | Number of I/O | Total RAM Bits | |
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Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 95 I/O 132CPGA
|
-55°C ~ 125°C (TC) | - | - | 14000 | 95 | - | ||
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
MX CERAMIC QUAD FLAT PACK
|
-55°C ~ 125°C (TC) | - | - | 24000 | 131 | - | |||
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
MX CERAMIC QUAD FLAT PACK
|
-55°C ~ 125°C (TC) | - | - | 24000 | 131 | - | |||
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA MX SGL CHIP 54K 256-CQFP
|
-55°C ~ 125°C (TJ) | 208-BFCQFP with Tie Bar | 208-CQFP (75x75) | 54000 | 176 | 2560 | |||
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA MX SGL CHIP 54K 256-CQFP
|
-55°C ~ 125°C (TJ) | 208-BFCQFP with Tie Bar | 208-CQFP (75x75) | 54000 | 176 | 2560 | |||
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA MX SGL CHIP 54K 256-CQFP
|
-55°C ~ 125°C (TJ) | 256-BFCQFP with Tie Bar | 256-CQFP (75x75) | 54000 | 202 | 2560 | |||
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA MX SGL CHIP 54K 256-CQFP
|
-55°C ~ 125°C (TJ) | 256-BFCQFP with Tie Bar | 256-CQFP (75x75) | 54000 | 202 | 2560 |
