- Series：
-
- Operating Temperature：
-
- Number of Gates：
-
- Number of Logic Elements/Cells：
-
- Total RAM Bits：
-
Découvrez les produits 300
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Number of Gates | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Number of Gates | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
|
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC FPGA 75 I/O 256FBGA
|
Fusion | -40°C ~ 100°C (TJ) | 90000 | 75 | - | - | 27648 | ||
|
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC FPGA 75 I/O 256FBGA
|
Fusion | -40°C ~ 100°C (TJ) | 90000 | 75 | - | - | 27648 | ||
|
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC FPGA 75 I/O 256FBGA
|
Fusion | -40°C ~ 100°C (TJ) | 90000 | 75 | - | - | 27648 | ||
|
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC FPGA 75 I/O 256FBGA
|
Fusion | 0°C ~ 85°C (TJ) | 90000 | 75 | - | - | 27648 | ||
|
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC FPGA 75 I/O 256FBGA
|
Fusion | 0°C ~ 85°C (TJ) | 90000 | 75 | - | - | 27648 | ||
|
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC FPGA 75 I/O 256FBGA
|
Fusion | 0°C ~ 85°C (TJ) | 90000 | 75 | - | - | 27648 | ||
|
|
Microsemi Corporation |
456
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 177 I/O 256FBGA
|
ProASIC3 | -40°C ~ 100°C (TJ) | 600000 | 177 | - | - | 110592 | |||
|
|
Microsemi Corporation |
184
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 177 I/O 256FBGA
|
ProASIC3 | -40°C ~ 100°C (TJ) | 600000 | 177 | - | - | 110592 | |||
|
|
Microsemi Corporation |
348
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 177 I/O 256FBGA
|
ProASIC3 | -40°C ~ 100°C (TJ) | 1000000 | 177 | - | - | 147456 | |||
|
|
Microsemi Corporation |
318
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 119 I/O 256FBGA
|
Fusion | 0°C ~ 85°C (TJ) | 600000 | 119 | - | - | 110592 | |||
|
|
Microsemi Corporation |
455
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 119 I/O 256FBGA
|
Fusion | -40°C ~ 100°C (TJ) | 600000 | 119 | - | - | 110592 | |||
|
|
Microsemi Corporation |
114
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 157 I/O 256FBGA
|
ProASIC3 | -40°C ~ 100°C (TJ) | 250000 | 157 | - | - | 36864 | |||
|
|
Microsemi Corporation |
232
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 177 I/O 256FBGA
|
ProASIC3 | -40°C ~ 100°C (TJ) | 1000000 | 177 | - | - | 147456 | |||
|
|
Microsemi Corporation |
32
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 119 I/O 256FBGA
|
Fusion | 0°C ~ 85°C (TJ) | 600000 | 119 | - | - | 110592 | |||
|
|
Microsemi Corporation |
92
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 157 I/O 256FBGA
|
ProASIC3 | 0°C ~ 85°C (TJ) | 250000 | 157 | - | - | 36864 | |||
|
|
Microsemi Corporation |
86
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
ProASIC3 | 0°C ~ 85°C (TJ) | 400000 | 178 | - | - | 55296 | |||
|
|
Microsemi Corporation |
78
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 157 I/O 256FBGA
|
ProASIC3 | -40°C ~ 100°C (TJ) | 250000 | 157 | - | - | 36864 | |||
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC FPGA 157 I/O 256FBGA
|
ProASIC3 | 0°C ~ 85°C (TJ) | 250000 | 157 | - | - | 36864 | |||
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC FPGA 157 I/O 256FBGA
|
ProASIC3 | 0°C ~ 85°C (TJ) | 250000 | 157 | - | - | 36864 | |||
|
|
Microsemi Corporation |
Enquête
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC FPGA 157 I/O 256FBGA
|
ProASIC3 | 0°C ~ 85°C (TJ) | 250000 | 157 | - | - | 36864 |
