Découvrez les produits 25
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Operating Temperature Package / Case Supplier Device Package Number of I/O
XCV800-4FG676C
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 444 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV800-4FG676I
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 444 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV800-5FG676C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 444 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV800-5FG676I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 444 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV800-6FG676C
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 444 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 444
XCV800-4BG432C
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 316 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 316
XCV800-4BG432I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 316 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 316
XCV800-4BG560C
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV800-4BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV800-4FG680C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV800-4FG680I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
-40°C ~ 100°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV800-4HQ240C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 166 I/O 240HQFP
0°C ~ 85°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 166
XCV800-4HQ240I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 166 I/O 240HQFP
-40°C ~ 100°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 166
XCV800-5BG432C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 316 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 316
XCV800-5BG432I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 316 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 316
XCV800-5BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV800-5BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV800-5FG680C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV800-5FG680I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
-40°C ~ 100°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV800-5HQ240C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 166 I/O 240HQFP
0°C ~ 85°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 166