- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Number of Gates:
-
- Total RAM Bits:
-
Découvrez les produits 27
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of Gates | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of Gates | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | ||
Xilinx Inc. |
40
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 260 I/O 456FBGA
|
Spartan-II | 0°C ~ 85°C (TJ) | 456-BBGA | 456-FBGA (23x23) | 150000 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 260 I/O 456FBGA
|
Spartan-II | 0°C ~ 85°C (TJ) | 456-BBGA | 456-FBGA (23x23) | 150000 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 260 I/O 456FBGA
|
Spartan-II | -40°C ~ 100°C (TJ) | 456-BBGA | 456-FBGA (23x23) | 150000 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 260 I/O 456FBGA
|
Spartan-II | 0°C ~ 85°C (TJ) | 456-BBGA | 456-FBGA (23x23) | 150000 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 260 I/O 456FBGA
|
Spartan-II | -40°C ~ 100°C (TJ) | 456-BBGA | 456-FBGA (23x23) | 150000 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 260 I/O 456FBGA
|
Spartan-II | 0°C ~ 85°C (TJ) | 456-BBGA | 456-FBGA (23x23) | 150000 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 260 I/O 456FBGA
|
Virtex | 0°C ~ 85°C (TJ) | 456-BBGA | 456-FBGA (23x23) | 164674 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 260 I/O 456FBGA
|
Virtex | -40°C ~ 100°C (TJ) | 456-BBGA | 456-FBGA (23x23) | 164674 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 260 I/O 456FBGA
|
Virtex | 0°C ~ 85°C (TJ) | 456-BBGA | 456-FBGA (23x23) | 164674 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 260 I/O 456FBGA
|
Virtex | -40°C ~ 100°C (TJ) | 456-BBGA | 456-FBGA (23x23) | 164674 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 260 I/O 456FBGA
|
Virtex | 0°C ~ 85°C (TJ) | 456-BBGA | 456-FBGA (23x23) | 164674 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 260 I/O 352MBGA
|
Virtex | 0°C ~ 85°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | 164674 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 260 I/O 352MBGA
|
Virtex | -40°C ~ 100°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | 164674 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 260 I/O 352MBGA
|
Virtex | 0°C ~ 85°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | 164674 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 260 I/O 352MBGA
|
Virtex | -40°C ~ 100°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | 164674 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 260 I/O 352MBGA
|
Virtex | 0°C ~ 85°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | 164674 | 864 | 3888 | 49152 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 260 I/O 352MBGA
|
Virtex | 0°C ~ 85°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | 236666 | 1176 | 5292 | 57344 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 260 I/O 352MBGA
|
Virtex | -40°C ~ 100°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | 236666 | 1176 | 5292 | 57344 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 260 I/O 352MBGA
|
Virtex | 0°C ~ 85°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | 236666 | 1176 | 5292 | 57344 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 260 I/O 352MBGA
|
Virtex | -40°C ~ 100°C (TJ) | 352-LBGA Exposed Pad,Metal | 352-MBGA (35x35) | 236666 | 1176 | 5292 | 57344 |