- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Number of Gates:
-
- Number of I/O:
-
- Number of LABs/CLBs:
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- Number of Logic Elements/Cells:
-
- Conditions sélectionnées:
Découvrez les produits 787
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of Gates | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of Gates | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | ||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 193 I/O 240HQFP
|
XC4000E/X | 0°C ~ 85°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) | 62000 | 193 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 193 I/O 240HQFP
|
XC4000E/X | -40°C ~ 100°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) | 62000 | 193 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 62000 | 352 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 62000 | 352 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 384 I/O 560MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 62000 | 384 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 384 I/O 560MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 62000 | 384 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 193 I/O 240HQFP
|
XC4000E/X | 0°C ~ 85°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) | 62000 | 193 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 193 I/O 240HQFP
|
XC4000E/X | -40°C ~ 100°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) | 62000 | 193 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 62000 | 352 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 62000 | 352 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 384 I/O 560MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 62000 | 384 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 384 I/O 560MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 62000 | 384 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 193 I/O 240HQFP
|
XC4000E/X | 0°C ~ 85°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) | 62000 | 193 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 193 I/O 240HQFP
|
XC4000E/X | -40°C ~ 100°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) | 62000 | 193 | 2304 | 5472 | 73728 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 85000 | 352 | 3136 | 7448 | 100352 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 85000 | 352 | 3136 | 7448 | 100352 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 448 I/O 560MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 85000 | 448 | 3136 | 7448 | 100352 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 448 I/O 560MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 85000 | 448 | 3136 | 7448 | 100352 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 85000 | 352 | 3136 | 7448 | 100352 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 85000 | 352 | 3136 | 7448 | 100352 |