- Operating Temperature：
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- Package / Case：
-
- Supplier Device Package：
-
- Number of Logic Elements/Cells：
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- Total RAM Bits：
-
Découvrez les produits 6
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
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Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
XCKU3P-L1SFVB784I
|
-40°C ~ 100°C (TJ) | 784-BBGA，FCBGA | 784-FCBGA (23x23) | 20340 | 355950 | 31641600 | ||
|
|
|
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
XCKU3P-L2SFVB784E
|
0°C ~ 100°C (TJ) | 784-BBGA，FCBGA | 784-FCBGA (23x23) | 20340 | 355950 | 31641600 | ||
|
|
|
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 256 I/O 676FCBGA
|
-40°C ~ 100°C (TJ) | 676-BBGA，FCBGA | 676-FCBGA (27x27) | 27120 | 474600 | 41984000 | ||
|
|
|
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
XCKU3P-L1FFVA676I
|
-40°C ~ 100°C (TJ) | 676-BBGA，FCBGA | 676-FCBGA (27x27) | 20340 | 355950 | 31641600 | ||
|
|
|
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
XCKU3P-L2FFVA676E
|
0°C ~ 100°C (TJ) | 676-BBGA，FCBGA | 676-FCBGA (27x27) | 20340 | 355950 | 31641600 | ||
|
|
|
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
XCKU5P-L2FFVA676E
|
0°C ~ 110°C (TJ) | 676-BBGA，FCBGA | 676-FCBGA (27x27) | 27120 | 474600 | 41984000 |
