- Operating Temperature：
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- Package / Case：
-
- Supplier Device Package：
-
- Number of Logic Elements/Cells：
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- Total RAM Bits：
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- Conditions sélectionnées:
Découvrez les produits 83
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
|
|
|
Intel |
6,972
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
0°C ~ 85°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 125 | 2000 | 110592 | ||
|
|
|
Intel |
7,670
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 125 | 2000 | 110592 | ||
|
|
|
Intel |
308
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 112 I/O 153MBGA
|
-40°C ~ 100°C (TJ) | 153-VFBGA | 153-MBGA (8x8) | 112 | 125 | 2000 | 110592 | ||
|
|
|
Intel |
3,211
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
-40°C ~ 100°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 125 | 2000 | 110592 | ||
|
|
|
Intel |
2,840
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
0°C ~ 85°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 250 | 4000 | 193536 | ||
|
|
|
Intel |
648
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
-40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 125 | 2000 | 110592 | ||
|
|
|
Intel |
1,156
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
0°C ~ 85°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
1,040
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 250 | 4000 | 193536 | ||
|
|
|
Intel |
2,059
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
-40°C ~ 100°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 250 | 4000 | 193536 | ||
|
|
|
Intel |
3,167
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
0°C ~ 85°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 250 | 4000 | 193536 | ||
|
|
|
Intel |
4,103
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
-40°C ~ 100°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
931
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 112 I/O 153MBGA
|
0°C ~ 85°C (TJ) | 153-VFBGA | 153-MBGA (8x8) | 112 | 250 | 4000 | 193536 | ||
|
|
|
Intel |
2,079
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
-40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 250 | 4000 | 193536 | ||
|
|
|
Intel |
6,919
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
0°C ~ 85°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
172
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 250 | 4000 | 193536 | ||
|
|
|
Intel |
3,073
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
219
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
-40°C ~ 100°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 250 | 4000 | 193536 | ||
|
|
|
Intel |
317
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
-40°C ~ 100°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
1,482
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
-40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 250 | 4000 | 193536 | ||
|
|
|
Intel |
1,696
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
-40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | 500 | 8000 | 387072 |
