Number of Gates:
Number of I/O:
Number of LABs/CLBs:
Number of Logic Elements/Cells:
Total RAM Bits:
Découvrez les produits 16
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Operating Temperature Package / Case Supplier Device Package Number of Gates Number of I/O Number of LABs/CLBs Number of Logic Elements/Cells Total RAM Bits
XCV405E-6FG676C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 404 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 129600 404 2400 10800 573440
XCV405E-6FG676I
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 404 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 129600 404 2400 10800 573440
XCV405E-7FG676C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 404 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 129600 404 2400 10800 573440
XCV405E-7FG676I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 129600 404 2400 10800 573440
XCV405E-8FG676C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 129600 404 2400 10800 573440
XCV812E-6FG900C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 556 I/O 900FBGA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 254016 556 4704 21168 1146880
XCV812E-7FG900C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 556 I/O 900FBGA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 254016 556 4704 21168 1146880
XCV812E-8FG900C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 556 I/O 900FBGA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 254016 556 4704 21168 1146880
XCV405E-6BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 2  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 129600 404 2400 10800 573440
XCV405E-6BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 129600 404 2400 10800 573440
XCV405E-7BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 129600 404 2400 10800 573440
XCV405E-7BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 129600 404 2400 10800 573440
XCV405E-8BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 129600 404 2400 10800 573440
XCV812E-6BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 254016 404 4704 21168 1146880
XCV812E-7BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 254016 404 4704 21168 1146880
XCV812E-8BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 254016 404 4704 21168 1146880