- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Number of Logic Elements/Cells：
-
- Total RAM Bits：
-
Découvrez les produits 165
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
|
|
|
Intel |
2,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
-40°C ~ 100°C (TJ) | 36-UFBGA，WLCSP | 36-WLCSP (3x3) | 27 | 125 | 2000 | 110592 | ||
|
|
|
Intel |
2,433
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
-40°C ~ 100°C (TJ) | 36-UFBGA，WLCSP | 36-WLCSP (3x3) | 27 | 125 | 2000 | 110592 | ||
|
|
|
Intel |
2,433
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
-40°C ~ 100°C (TJ) | 36-UFBGA，WLCSP | 36-WLCSP (3x3) | 27 | 125 | 2000 | 110592 | ||
|
|
|
Intel |
337
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 160 I/O 324UBGA
|
0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 160 | 125 | 2000 | 110592 | ||
|
|
|
Intel |
346
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | 250 | 4000 | 193536 | ||
|
|
|
Intel |
1,047
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | 250 | 4000 | 193536 | ||
|
|
|
Intel |
167
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
1,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
-40°C ~ 100°C (TJ) | 81-UFBGA，WLCSP | 81-VBGA，WLCSP (4.5x4.4) | 56 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
1,274
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
-40°C ~ 100°C (TJ) | 81-UFBGA，WLCSP | 81-VBGA，WLCSP (4.5x4.4) | 56 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
1,274
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
-40°C ~ 100°C (TJ) | 81-UFBGA，WLCSP | 81-VBGA，WLCSP (4.5x4.4) | 56 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
602
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
221
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 246 I/O 324UBGA
|
0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 246 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
496
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
-40°C ~ 100°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
111
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 246 I/O 324UBGA
|
-40°C ~ 100°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 246 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
1,362
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
-40°C ~ 100°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | 500 | 8000 | 387072 | ||
|
|
|
Intel |
186
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 246 I/O 324UBGA
|
0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 246 | 1000 | 16000 | 562176 | ||
|
|
|
Intel |
180
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 320 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 320 | 1000 | 16000 | 562176 | ||
|
|
|
Intel |
322
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
-40°C ~ 100°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | 1000 | 16000 | 562176 | ||
|
|
|
Intel |
113
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | 2500 | 40000 | 1290240 | ||
|
|
|
Intel |
193
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | 2500 | 40000 | 1290240 |
