- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Output：
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- Ratio - Input:Output：
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- Differential - Input:Output：
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- Frequency - Max：
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- Type：
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- Conditions sélectionnées:
Découvrez les produits 304
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Output | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Output | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | Type | |
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Analog Devices Inc. |
1,500
|
3 jours |
-
|
MOQ: 1500 MPQ: 1
|
IC CLK BUFFER 1:3 800MHZ 32LFCSP
|
Tape & Reel (TR) | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad，CSP | 32-LFCSP-VQ (5x5) | CMOS，LVDS | 1 | 0.04375 | Yes/Yes | 800MHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Analog Devices Inc. |
2,457
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:3 800MHZ 32LFCSP
|
Cut Tape (CT) | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad，CSP | 32-LFCSP-VQ (5x5) | CMOS，LVDS | 1 | 0.04375 | Yes/Yes | 800MHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Analog Devices Inc. |
2,457
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:3 800MHZ 32LFCSP
|
- | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad，CSP | 32-LFCSP-VQ (5x5) | CMOS，LVDS | 1 | 0.04375 | Yes/Yes | 800MHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Analog Devices Inc. |
750
|
3 jours |
-
|
MOQ: 250 MPQ: 1
|
IC CLK BUFFER 1:2 7.5GHZ 16LFCSP
|
Tape & Reel (TR) | SiGe | 2.375 V ~ 3.63 V | -40°C ~ 125°C | 16-VFQFN Exposed Pad，CSP | 16-LFCSP-VQ (3x3) | ECL，NECL，PECL | 1 | 0.04305555555555556 | Yes/Yes | 7.5GHz | Surface Mount | Buffer/Driver，Data | ||
|
|
|
Analog Devices Inc. |
775
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 7.5GHZ 16LFCSP
|
Cut Tape (CT) | SiGe | 2.375 V ~ 3.63 V | -40°C ~ 125°C | 16-VFQFN Exposed Pad，CSP | 16-LFCSP-VQ (3x3) | ECL，NECL，PECL | 1 | 0.04305555555555556 | Yes/Yes | 7.5GHz | Surface Mount | Buffer/Driver，Data | ||
|
|
|
Analog Devices Inc. |
775
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 7.5GHZ 16LFCSP
|
- | SiGe | 2.375 V ~ 3.63 V | -40°C ~ 125°C | 16-VFQFN Exposed Pad，CSP | 16-LFCSP-VQ (3x3) | ECL，NECL，PECL | 1 | 0.04305555555555556 | Yes/Yes | 7.5GHz | Surface Mount | Buffer/Driver，Data | ||
|
|
|
Texas Instruments |
1,250
|
3 jours |
-
|
MOQ: 250 MPQ: 1
|
IC CLK BUFFER 1:8 1.6GHZ 48WQFN
|
Tape & Reel (TR) | - | 3.15 V ~ 3.45 V | -40°C ~ 85°C | 48-WFQFN Exposed Pad | 48-WQFN (7x7) | LVPECL | 1 | 0.04722222222222222 | Yes/Yes | 1.6GHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Texas Instruments |
2,703
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:8 1.6GHZ 48WQFN
|
Cut Tape (CT) | - | 3.15 V ~ 3.45 V | -40°C ~ 85°C | 48-WFQFN Exposed Pad | 48-WQFN (7x7) | LVPECL | 1 | 0.04722222222222222 | Yes/Yes | 1.6GHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Texas Instruments |
2,703
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:8 1.6GHZ 48WQFN
|
- | - | 3.15 V ~ 3.45 V | -40°C ~ 85°C | 48-WFQFN Exposed Pad | 48-WQFN (7x7) | LVPECL | 1 | 0.04722222222222222 | Yes/Yes | 1.6GHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Texas Instruments |
1,000
|
3 jours |
-
|
MOQ: 250 MPQ: 1
|
IC CLK BUFFER 2:8 1.6GHZ 48WQFN
|
Tape & Reel (TR) | - | 3.15 V ~ 3.45 V | -40°C ~ 85°C | 48-WFQFN Exposed Pad | 48-WQFN (7x7) | LVDS，LVPECL | 1 | 0.08888888888888889 | Yes/Yes | 1.6GHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Texas Instruments |
2,539
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:8 1.6GHZ 48WQFN
|
Cut Tape (CT) | - | 3.15 V ~ 3.45 V | -40°C ~ 85°C | 48-WFQFN Exposed Pad | 48-WQFN (7x7) | LVDS，LVPECL | 1 | 0.08888888888888889 | Yes/Yes | 1.6GHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Texas Instruments |
2,539
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:8 1.6GHZ 48WQFN
|
- | - | 3.15 V ~ 3.45 V | -40°C ~ 85°C | 48-WFQFN Exposed Pad | 48-WQFN (7x7) | LVDS，LVPECL | 1 | 0.08888888888888889 | Yes/Yes | 1.6GHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Analog Devices Inc. |
374
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 1.6GHZ 32LFCSP
|
Tray | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad，CSP | 32-LFCSP-VQ (5x5) | CMOS，LVDS，LVPECL | 1 | 0.04305555555555556 | Yes/Yes | 1.6GHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Analog Devices Inc. |
310
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 7.5GHZ 16LFCSP
|
Tray | SiGe | 2.375 V ~ 3.63 V | -40°C ~ 125°C | 16-VFQFN Exposed Pad，CSP | 16-LFCSP-VQ (3x3) | ECL，NECL，PECL | 1 | 0.04305555555555556 | Yes/Yes | 7.5GHz | Surface Mount | Buffer/Driver，Data | ||
|
|
|
Texas Instruments |
250
|
3 jours |
-
|
MOQ: 250 MPQ: 1
|
IC CLK BUFFER 1:8 1.6GHZ 48WQFN
|
Tape & Reel (TR) | - | 3.15 V ~ 3.45 V | -40°C ~ 85°C | 48-WFQFN Exposed Pad | 48-WQFN (7x7) | LVDS | 1 | 0.04722222222222222 | Yes/Yes | 1.6GHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Texas Instruments |
1,543
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:8 1.6GHZ 48WQFN
|
Cut Tape (CT) | - | 3.15 V ~ 3.45 V | -40°C ~ 85°C | 48-WFQFN Exposed Pad | 48-WQFN (7x7) | LVDS | 1 | 0.04722222222222222 | Yes/Yes | 1.6GHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Texas Instruments |
1,543
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:8 1.6GHZ 48WQFN
|
- | - | 3.15 V ~ 3.45 V | -40°C ~ 85°C | 48-WFQFN Exposed Pad | 48-WQFN (7x7) | LVDS | 1 | 0.04722222222222222 | Yes/Yes | 1.6GHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Analog Devices Inc. |
340
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:3 1.6GHZ 32LFCSP
|
Tray | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad，CSP | 32-LFCSP-VQ (5x5) | CMOS，LVDS，LVPECL | 1 | 0.04375 | Yes/Yes | 1.6GHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Analog Devices Inc. |
148
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:3 800MHZ 32LFCSP
|
Tray | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad，CSP | 32-LFCSP-VQ (5x5) | CMOS，LVDS | 1 | 0.04375 | Yes/Yes | 800MHz | Surface Mount | Fanout Buffer (Distribution)，Divider | ||
|
|
|
Analog Devices Inc. |
169
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:8 1.2GHZ 64LFCSP
|
Tray | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 64-VFQFN Exposed Pad，CSP | 64-LFCSP-VQ (9x9) | CMOS，LVDS，LVPECL | 1 | 0.08888888888888889 | Yes/Yes | 1.2GHz | Surface Mount | Fanout Buffer (Distribution)，Divider |
